通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
48-6575-11

48-6575-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,573
48-6575-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
324-13-164-41-002000

324-13-164-41-002000

SOCKET 4 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

3,827
324-13-164-41-002000

规格书

324 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
MHAS-181-ZMGG-15

MHAS-181-ZMGG-15

CONN SOCKET BGA 181POS GOLD

Samtec Inc.

3,418
MHAS-181-ZMGG-15

规格书

MHA Bulk Obsolete BGA 181 (15 x 15) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,606
48-6503-21

规格书

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
517-83-475-21-121111

517-83-475-21-121111

CONN SOCKET PGA 475POS GOLD

Preci-Dip

3,780
517-83-475-21-121111

规格书

517 Bulk Active PGA 475 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-364-17-091147

546-87-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip

4,082
546-87-364-17-091147

规格书

546 Bulk Active PGA 364 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0930-G-H

APH-0930-G-H

APH-0930-G-H

Samtec Inc.

4,068

-

* - Active - - - - - - - - - - - - - - -
APH-1430-G-H

APH-1430-G-H

APH-1430-G-H

Samtec Inc.

3,097

-

* - Active - - - - - - - - - - - - - - -
APH-0530-G-H

APH-0530-G-H

APH-0530-G-H

Samtec Inc.

2,281

-

* - Active - - - - - - - - - - - - - - -
APH-1530-G-H

APH-1530-G-H

APH-1530-G-H

Samtec Inc.

1,116

-

* - Active - - - - - - - - - - - - - - -
APH-1930-G-H

APH-1930-G-H

APH-1930-G-H

Samtec Inc.

1,735

-

* - Active - - - - - - - - - - - - - - -
APH-1230-G-H

APH-1230-G-H

APH-1230-G-H

Samtec Inc.

4,329

-

* - Active - - - - - - - - - - - - - - -
APH-0730-G-H

APH-0730-G-H

APH-0730-G-H

Samtec Inc.

3,442

-

* - Active - - - - - - - - - - - - - - -
APH-1330-G-H

APH-1330-G-H

APH-1330-G-H

Samtec Inc.

3,223

-

* - Active - - - - - - - - - - - - - - -
546-87-365-14-000147

546-87-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

4,788
546-87-365-14-000147

规格书

546 Bulk Active PGA 365 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-365-17-091147

546-87-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

1,273
546-87-365-17-091147

规格书

546 Bulk Active PGA 365 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0712-T-19

HLS-0712-T-19

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,999
HLS-0712-T-19

规格书

HLS Bulk Active SIP 87 (7 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
514-83-281-19-081117

514-83-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

2,178
514-83-281-19-081117

规格书

514 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-255M16-001148

514-83-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip

4,895
514-83-255M16-001148

规格书

514 Bulk Active BGA 255 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1338-G-H

APH-1338-G-H

APH-1338-G-H

Samtec Inc.

4,938

-

* - Active - - - - - - - - - - - - - - -
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