13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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APH-0238-G-TAPH-0238-G-T |
1,352 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0638-G-TAPH-0638-G-T |
1,701 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1138-G-TAPH-1138-G-T |
3,448 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0338-G-TAPH-0338-G-T |
3,137 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-0738-G-TAPH-0738-G-T |
4,344 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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50-9503-21CONN IC DIP SOCKET 50POS GOLD |
3,307 |
|
规格书 |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
50-9503-31CONN IC DIP SOCKET 50POS GOLD |
2,504 |
|
规格书 |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
510-93-149-15-061003SKT PGA SOLDRTL |
1,598 |
|
规格书 |
510 | Bulk | Active | PGA | 149 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
.JPG)
|
299-43-630-10-002000CONN IC DIP SOCKET 30POS GOLD |
1,030 |
|
规格书 |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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APH-1828-G-RAPH-1828-G-R |
3,479 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0928-G-RAPH-0928-G-R |
3,604 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1928-G-RAPH-1928-G-R |
2,580 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1028-G-RAPH-1028-G-R |
1,091 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1628-G-RAPH-1628-G-R |
4,714 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1728-G-RAPH-1728-G-R |
3,298 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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48-3574-11CONN IC DIP SOCKET ZIF 48POS TIN |
1,349 |
|
规格书 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
HLS-0513-G-38.100" SCREW MACHINE SOCKET ARRAY |
3,853 |
|
规格书 |
HLS | Bulk | Active | SIP | 65 (5 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
510-13-089-12-051001SKT PGA SOLDRTL |
2,217 |
|
规格书 |
510 | Bulk | Active | PGA | 89 (12 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
510-93-153-15-061001SKT PGA SOLDRTL |
2,525 |
|
规格书 |
510 | Bulk | Active | PGA | 153 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
110-13-640-61-801000CONN IC SKT DBL |
4,977 |
|
- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
