IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
44-6575-11 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	3,561	-	立即询价	规格书	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
145-PGM15023-50 CONN SOCKET PGA GOLD Aries Electronics	4,349	-	立即询价	规格书	PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
116-43-952-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,060	-	立即询价	-	116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-93-952-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,255	-	立即询价	-	116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APH-0536-G-H APH-0536-G-H Samtec Inc.	2,093	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1436-G-H APH-1436-G-H Samtec Inc.	4,702	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0936-G-H APH-0936-G-H Samtec Inc.	4,233	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1936-G-H APH-1936-G-H Samtec Inc.	2,059	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1236-G-H APH-1236-G-H Samtec Inc.	4,597	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1736-G-H APH-1736-G-H Samtec Inc.	3,809	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1336-G-H APH-1336-G-H Samtec Inc.	4,255	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0736-G-H APH-0736-G-H Samtec Inc.	4,846	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0836-G-H APH-0836-G-H Samtec Inc.	2,468	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1136-G-H APH-1136-G-H Samtec Inc.	4,801	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0236-G-H APH-0236-G-H Samtec Inc.	3,603	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0436-G-H APH-0436-G-H Samtec Inc.	2,610	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APO-632-G-B .100" LOW PROFILE SCREW MACHINE Samtec Inc.	1,244	-	立即询价	规格书	APO	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
HLS-0611-T-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	1,389	-	立即询价	规格书	HLS	Bulk	Active	SIP	66 (6 x 11)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
614-83-225-17-061112 CONN SOCKET PGA 225POS GOLD Preci-Dip	2,213	-	立即询价	规格书	614	Bulk	Active	PGA	225 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
510-13-084-10-031001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	1,900	-	立即询价	规格书	510	Tube	Active	PGA	84 (10 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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