通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
42-3574-11

42-3574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,064
42-3574-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3575-11

42-3575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,488
42-3575-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6571-11

42-6571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

4,248
42-6571-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6572-11

42-6572-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

1,778
42-6572-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6574-11

42-6574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,144
42-6574-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6575-11

42-6575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

1,389
42-6575-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6571-11

44-6571-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

4,511
44-6571-11

规格书

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0620-T-22

HLS-0620-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,390
HLS-0620-T-22

规格书

HLS Bulk Active SIP 120 (6 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-41-169-17-101002

510-41-169-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,418
510-41-169-17-101002

规格书

510 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-964-61-001000

110-13-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,921

-

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-192M16-001106

518-77-192M16-001106

CONN SOCKET PGA 192POS GOLD

Preci-Dip

2,353
518-77-192M16-001106

规格书

518 Bulk Active PGA 192 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1836-G-T

APH-1836-G-T

APH-1836-G-T

Samtec Inc.

3,999

-

* - Active - - - - - - - - - - - - - - -
APH-0536-G-T

APH-0536-G-T

APH-0536-G-T

Samtec Inc.

3,937

-

* - Active - - - - - - - - - - - - - - -
APH-0236-G-T

APH-0236-G-T

APH-0236-G-T

Samtec Inc.

2,691

-

* - Active - - - - - - - - - - - - - - -
APH-0736-G-T

APH-0736-G-T

APH-0736-G-T

Samtec Inc.

4,644

-

* - Active - - - - - - - - - - - - - - -
APH-1336-G-T

APH-1336-G-T

APH-1336-G-T

Samtec Inc.

2,146

-

* - Active - - - - - - - - - - - - - - -
APH-1236-G-T

APH-1236-G-T

APH-1236-G-T

Samtec Inc.

3,801

-

* - Active - - - - - - - - - - - - - - -
APH-0336-G-T

APH-0336-G-T

APH-0336-G-T

Samtec Inc.

3,565

-

* - Active - - - - - - - - - - - - - - -
APH-0436-G-T

APH-0436-G-T

APH-0436-G-T

Samtec Inc.

1,422

-

* - Active - - - - - - - - - - - - - - -
APH-1136-G-T

APH-1136-G-T

APH-1136-G-T

Samtec Inc.

3,417

-

* - Active - - - - - - - - - - - - - - -
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