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购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-316-10-003101CONN IC DIP SOCKET 16POS GOLD |
2,664 |
|
规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
2445893-3DIP IC SOCKET 20P SMT |
3,000 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
D2608-42CONN IC DIP SOCKET 8POS GOLD |
2,312 |
|
规格书 |
D26 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
2485264-4DIP IC SOCKET 18P,GOLD FLASH |
5,280 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
2445893-2DIP IC SOCKET 16P SMT |
3,000 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
ICO-308-STTCONN IC DIP SOCKET 8POS TIN |
111 |
|
规格书 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
2485264-7DIP IC SOCKET 28P,GOLD FLASH |
3,822 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
116-83-314-41-006101CONN IC DIP SOCKET 14POS GOLD |
2,396 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
SMPX-52LCC-PSMT PLCC SOCKET 52P POLARISED RO |
203 |
|
规格书 |
SMPX | Tube | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -50°C ~ 105°C |
|
146-43-308-41-013000CONN IC DIP SOCKET 8POS GOLD |
120 |
|
规格书 |
146 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
237 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,016 |
|
规格书 |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
940-44-032-17-400004CONN SOCKET PLCC 32POS SMD |
390 |
|
规格书 |
940 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
|
ICO-314-MTT.100" LOW PROFILE SCREW MACHINE |
2,798 |
|
规格书 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
8452-21B1-RK-TRCONN SOCKET PLCC 52POS TIN |
1,857 |
|
规格书 |
8400 | Tape & Reel (TR) | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
4602CONN TRANSIST TO-3 3POS TIN |
1,759 |
|
规格书 |
- | Bulk | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
|
|
2485265-1DIP IC SOCKET 40P,GOLD FLASH |
1,950 |
|
规格书 |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
540-44-032-17-400004CONN SKT PLCC |
800 |
|
规格书 |
540 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
123-83-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
1,058 |
|
规格书 |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-93-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
183 |
|
规格书 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
