13360502897
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购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2444090-3CONN SOCKET SIP 16POS GOLD |
4,862 |
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规格书 |
- | Bulk | Active | SIP | 16 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
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2444090-5CONN SOCKET SIP 20POS GOLD |
3,457 |
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规格书 |
- | Bulk | Active | SIP | 20 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
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2485267-1DIP IC SOCKET 6P,GOLD FLASH-SMD |
5,400 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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2485267-2DIP IC SOCKET 8P,GOLD FLASH-SMD |
5,397 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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2485267-3DIP IC SOCKET 10P,GOLD FLASH-SMD |
5,400 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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|
2485267-4DIP IC SOCKET 12P,GOLD FLASH-SMD |
5,399 |
|
规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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ICF-308-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
950 |
|
规格书 |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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05-0518-00CONN SOCKET SIP 5POS GOLD |
885 |
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规格书 |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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115-47-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
1,067 |
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规格书 |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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2445893-1DIP IC SOCKET 8P SMT |
4,500 |
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规格书 |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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SMPX-32LCC-NSMT PLCC SOCKET 32P NON POLARISE |
179 |
|
规格书 |
SMPX | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -50°C ~ 105°C |
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2444090-1CONN SOCKET SIP 10POS GOLD |
1,698 |
|
规格书 |
- | Bulk | Active | SIP | 10 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
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2485264-5DIP IC SOCKET 18P,SN |
5,720 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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8420-21A1-RK-TPCONN SOCKET PLCC 20POS TIN |
2,808 |
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规格书 |
8400 | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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2485264-2DIP IC SOCKET 14P-SN |
7,641 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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2444090-4SIP IC SKT 20 AU0.75 |
1,121 |
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规格书 |
- | Tray | Active | SIP | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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2485264-6DIP IC SOCKET 20P,SN |
5,228 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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2485264-3DIP IC SOCKET 16P,SN |
6,519 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
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8420-21B1-RK-TRCONN SOCKET PLCC 20POS TIN |
1,286 |
|
规格书 |
8400 | Tape & Reel (TR) | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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214-44-308-01-670799STANDRD SOLDER TAIL DIP SOCKET |
1,000 |
|
规格书 |
214 | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
