13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
111-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
170 |
|
规格书 |
111 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-308-11-001000CONN IC DIP SOCKET 8POS GOLD |
136 |
|
规格书 |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
614-93-320-31-012000CONN IC DIP SOCKET 20POS GOLD |
381 |
|
规格书 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-43-320-31-012000CONN IC DIP SOCKET 20POS GOLD |
159 |
|
规格书 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
ICA-320-SGGCONN IC DIP SOCKET 20POS GOLD |
2,028 |
|
规格书 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
614-93-628-31-012000CONN IC DIP SOCKET 28POS GOLD |
1,518 |
|
规格书 |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-43-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
207 |
|
规格书 |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
123-93-314-41-801000CONN IC DIP SOCKET 14POS GOLD |
137 |
|
规格书 |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-43-324-41-801000CONN IC DIP SOCKET 24POS GOLD |
209 |
|
规格书 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-610-10-002000CONN IC DIP SOCKET 10POS GOLD |
102 |
|
规格书 |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
317-43-121-41-005000CONN SOCKET 21POS .070 STR GOLD |
339 |
|
规格书 |
317 | Tube | Active | SIP | 21 (1 x 21) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-618-10-002000CONN IC DIP SOCKET 18POS GOLD |
107 |
|
规格书 |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
ICF-632-S-O-TRCONN IC DIP SOCKET 32POS TIN |
271 |
|
规格书 |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
2319757-1DUAL LGA,257 POS, DMD SOCKET |
1,140 |
|
规格书 |
DMD | Tray | Active | LGA | 257 (20 x 30) | 0.039" (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic | -25°C ~ 100°C |
|
1-2324271-6LEFT SEGMEN LGA4189-5 SOCKET-P5 |
156 |
|
规格书 |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1-2324271-5RIGHT SEGMEN LGA4189-5 SOCKET-P5 |
149 |
|
规格书 |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
2-2129710-7CONN SOCKET LGA 3647POS GOLD |
222 |
|
规格书 |
- | Tray | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic | - |
|
|
1-2324271-7RIGHT SEGMEN LGA4189-5 SOCKET-P5 |
2,724 |
|
规格书 |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1-2324271-8LEFT SEGMEN LGA4189-5 SOCKET-P5 |
1,366 |
|
规格书 |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
2-2822979-4CONN SOCKET LGA 3647POS GOLD |
4,258 |
|
规格书 |
- | Tray | Active | LGA | 3647 | 0.039" (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | - |
