通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
AW 127-32/Z-T

AW 127-32/Z-T

SOCKET 32 CONTACTS SINGLE ROW

Assmann WSW Components

4,568
AW 127-32/Z-T

规格书

- - Active - - - - - - - - - - - - - - -
AR 18-HZL/07-TT

AR 18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

1,463
AR 18-HZL/07-TT

规格书

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR22-HZW/T

AR22-HZW/T

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

1,265
AR22-HZW/T

规格书

- Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR24-HZL/07-TT

AR24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

1,782
AR24-HZL/07-TT

规格书

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR24-HZW/T

AR24-HZW/T

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

3,003
AR24-HZW/T

规格书

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A 24-LC-TR01

A 24-LC-TR01

24 (2 X 12) POS DIP, 0.3" (7.62M

Assmann WSW Components

2,130
A 24-LC-TR01

规格书

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
AR32-HZL/01-TT

AR32-HZL/01-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

1,994
AR32-HZL/01-TT

规格书

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 64-HGL-TT

AR 64-HGL-TT

SOCKET

Assmann WSW Components

3,549

-

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 18-HZW/TN

AR 18-HZW/TN

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

1,682
AR 18-HZW/TN

规格书

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR20-HZW/T

AR20-HZW/T

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

4,731

-

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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