通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
A40-LCG-T-R

A40-LCG-T-R

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

2,875
A40-LCG-T-R

规格书

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-ICS-254-12-TT50

A-ICS-254-12-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

1,143
A-ICS-254-12-TT50

规格书

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A48-LCG-T-R

A48-LCG-T-R

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

3,795
A48-LCG-T-R

规格书

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
AR20-HZL/01-TT-R

AR20-HZL/01-TT-R

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

1,156
AR20-HZL/01-TT-R

规格书

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 42-HZL/01-TT

AR 42-HZL/01-TT

SOCKET

Assmann WSW Components

4,134

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 22-HZL/07-TT

AR 22-HZL/07-TT

SOCKET

Assmann WSW Components

1,512

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR32-HZL/07-TT

AR32-HZL/07-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

3,740
AR32-HZL/07-TT

规格书

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 48 HGL-TT

AR 48 HGL-TT

SOCKET

Assmann WSW Components

3,019

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 48-HZL/01-TT

AR 48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

2,658
AR 48-HZL/01-TT

规格书

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 22-HZL/01-TT

AR 22-HZL/01-TT

SOCKET

Assmann WSW Components

4,840

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
深圳市通胜兴电子有限公司

搜索

深圳市通胜兴电子有限公司

产品

深圳市通胜兴电子有限公司

电话

深圳市通胜兴电子有限公司

会员