通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
AR24-HZL/7/01-TT

AR24-HZL/7/01-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

4,787

-

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 42-HGL-TT

AR 42-HGL-TT

SOCKET

Assmann WSW Components

2,957

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR28-HZL/7/01-TT

AR28-HZL/7/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

3,119

-

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS084-Z-SM/P

A-CCS084-Z-SM/P

SOCKET

Assmann WSW Components

2,107

-

- Bulk Active PLCC 84 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
A-ICS-254-06-TT50

A-ICS-254-06-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

1,821
A-ICS-254-06-TT50

规格书

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS 020-Z-SM/T

A-CCS 020-Z-SM/T

IC SOCKET, CHIP CARRIER, 1.27MM,

Assmann WSW Components

4,159
A-CCS 020-Z-SM/T

规格书

- Tape & Reel (TR) Active PLCC 20 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
A24-LCG-T-R

A24-LCG-T-R

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

2,961
A24-LCG-T-R

规格书

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
AR16-HZW/T

AR16-HZW/T

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

2,610
AR16-HZW/T

规格书

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS044-Z-SM/T

A-CCS044-Z-SM/T

SOCKET

Assmann WSW Components

4,206
A-CCS044-Z-SM/T

规格书

- Bulk Active PLCC 44 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AR20-HZL/07-TT

AR20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

4,759
AR20-HZL/07-TT

规格书

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
深圳市通胜兴电子有限公司

搜索

深圳市通胜兴电子有限公司

产品

深圳市通胜兴电子有限公司

电话

深圳市通胜兴电子有限公司

会员