通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 冷却封装 附件方式 形状 长度 宽度 直径 Fin 高度 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理



























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

散热器

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 冷却封装 附件方式 形状 长度 宽度 直径 Fin 高度 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
HSB25-282810

HSB25-282810

HEAT SINK, BGA, 28.5 X 28.5 X 10

Same Sky (Formerly CUI Devices)

1,544
HSB25-282810

规格书

HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 4.87W @ 75°C 5.10°C/W @ 200 LFM 15.41°C/W Aluminum Alloy Black Anodized
7139DG

7139DG

HEATSINK TO-220 TIN CLIP-ON 13MM

Boyd Laconia, LLC

3,129
7139DG

规格书

- Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.5W @ 50°C 8.00°C/W @ 500 LFM 28.30°C/W Copper Tin
531002B00000G

531002B00000G

HEATSINK TO-220 BLACK 1"

Boyd Laconia, LLC

2,312
531002B00000G

规格书

- Box Active Board Level, Vertical TO-220, TO-202 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 3.0W @ 40°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
529802B00000G

529802B00000G

HEATSINK TO-220 10W H=1.5" BLK

Boyd Laconia, LLC

8,427
529802B00000G

规格书

- Box Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 8.0W @ 40°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
575703B00000G

575703B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,133
575703B00000G

规格书

- Bulk Active Board Level TO-3 Bolt On Rhombus 1.630" (41.40mm) 1.290" (32.77mm) - 0.750" (19.05mm) 2.0W @ 30°C 4.00°C/W @ 200 LFM 13.40°C/W Aluminum Black Anodized
6030D(COPPER)G

6030D(COPPER)G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

432
6030D(COPPER)G

规格书

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 12.50°C/W Copper Tin
V5220X

V5220X

HEATSINK ANOD ALUM W/PIN TO-220

Assmann WSW Components

606
V5220X

规格书

- Tray Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.476" (37.50mm) 1.260" (32.00mm) - 0.787" (19.99mm) - - 8.00°C/W Aluminum Black Anodized
TGH-0130-03

TGH-0130-03

ALUMINIUM HEAT SINK 35X13MM

t-Global Technology

297
TGH-0130-03

规格书

TGH Bulk Active Top Mount - - Rectangular, Fins 1.378" (35.00mm) 0.512" (13.00mm) - 0.236" (6.00mm) - - - Aluminum Black Anodized
ATS-PCB1074

ATS-PCB1074

HEATSINK TO-263 COPPER

Advanced Thermal Solutions Inc.

11,043
ATS-PCB1074

规格书

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) - Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.401" (10.20mm) - 9.50°C/W @ 200 LFM 18.00°C/W Copper Tin
V2277E1

V2277E1

CPU HEATSINK, CROSS CUT, AL6063,

Assmann WSW Components

292
V2277E1

规格书

- Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) - - 26.00°C/W Aluminum Alloy Black Anodized
576802B03100G

576802B03100G

HEAT SINK HORIZ PLUG-IN TO-220

Boyd Laconia, LLC

13,633
576802B03100G

规格书

- Bulk Active Board Level TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
625-45AB

625-45AB

HEATSINK CPU 25MM SQ H=.45" BLK

Wakefield-Vette

2,168
625-45AB

规格书

625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.450" (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
529701B02500G

529701B02500G

HEATSINK TO-218 SOLDER PIN

Boyd Laconia, LLC

16,835
529701B02500G

规格书

- Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
M47118B011000G

M47118B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

607
M47118B011000G

规格书

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 1.180" (29.97mm) 0.764" (19.40mm) - 1.240" (31.50mm) - - - Aluminum Black Anodized
HSB15-404010

HSB15-404010

HEAT SINK, BGA, 40 X 40 X 10 MM

Same Sky (Formerly CUI Devices)

202
HSB15-404010

规格书

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) 6.3W @ 75°C 3.90°C/W @ 200 LFM 11.84°C/W Aluminum Alloy Black Anodized
579103B00000G

579103B00000G

HEATSINK TO-3 BLACK .87"

Boyd Laconia, LLC

1,075
579103B00000G

规格书

- Bag Active Top Mount TO-3 Bolt On Rhombus 1.540" (39.12mm) - 1.125" (28.57mm) OD 0.870" (22.10mm) 2.5W @ 40°C 4.00°C/W @ 600 LFM 12.50°C/W Aluminum Black Anodized
HSS01-B20-CP

HSS01-B20-CP

HEAT SINK, STAMPING, TO-220, 49.

Same Sky (Formerly CUI Devices)

975
HSS01-B20-CP

规格书

HSS Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.941" (49.31mm) 1.900" (48.26mm) - 0.950" (24.13mm) 9.9W @ 75°C 3.70°C/W @ 200 LFM 7.59°C/W Aluminum Alloy Black Anodized
HSB14-353518

HSB14-353518

HEAT SINK, BGA, 35 X 35 X 18 MM

Same Sky (Formerly CUI Devices)

681
HSB14-353518

规格书

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.709" (18.00mm) 8.4W @ 75°C 3.60°C/W @ 200 LFM 8.97°C/W Aluminum Alloy Black Anodized
TGH-0220-06

TGH-0220-06

ALUMINIUM HEAT SINK 27X22MM

t-Global Technology

229
TGH-0220-06

规格书

TGH Bulk Active Top Mount - - Rectangular, Pin Fins 1.063" (27.00mm) 0.866" (22.00mm) - 0.354" (9.00mm) - - - Aluminum Black Anodized
534202B02853G

534202B02853G

HEATSINK TO-220 W/SHURLOCK-CLIP

Boyd Laconia, LLC

19,247
534202B02853G

规格书

- Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.40°C/W Aluminum Black Anodized
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