通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度
SMDSWLF.015 1LB

SMDSWLF.015 1LB

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

2,111
SMDSWLF.015 1LB

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015" (0.38mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 27 AWG, 28 SWG - Lead Free Spool, 1 lb (454 g) - - -
RASWLF.015 1LB

RASWLF.015 1LB

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

4,875
RASWLF.015 1LB

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015" (0.38mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 27 AWG, 28 SWG - Lead Free Spool, 1 lb (454 g) - - -
SMD2170

SMD2170

SOLDER SPHERES SN63/PB37 .014" (

Chip Quik Inc.

2,734
SMD2170

规格书

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.014" (0.36mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
TS991SNL500T3

TS991SNL500T3

SOLDER PASTE THERMALLY STABLE NC

Chip Quik Inc.

3,359
TS991SNL500T3

规格书

CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) No-Clean - 3 Lead Free Jar, 17.64 oz (500g) 12 Months Date of Manufacture -
WS991AX500T4

WS991AX500T4

SOLDER PASTE THERMALLY STABLE WS

Chip Quik Inc.

1,170
WS991AX500T4

规格书

CHIPQUIK® Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 4 Leaded Jar, 17.64 oz (500g) 6 Months Date of Manufacture -
SMD2150

SMD2150

SOLDER SPHERES SN63/PB37 .010" (

Chip Quik Inc.

3,721
SMD2150

规格书

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.010" (0.25mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
SMDSWLF.059 3.3 1LB

SMDSWLF.059 3.3 1LB

SOLDER WIRE SN96.5/AG3.0/CU0.5

Chip Quik Inc.

1,589
SMDSWLF.059 3.3 1LB

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.059" (1.50mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - - Lead Free Spool, 1 lb (453.59g) - - -
WS991LT500T4

WS991LT500T4

SOLDER PASTE THERMALLY STABLE WS

Chip Quik Inc.

1,089
WS991LT500T4

规格书

CHIPQUIK® Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) Water Soluble - 4 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture -
SMD4300LTLFP250T4

SMD4300LTLFP250T4

SOLDER PASTE SN42/BI57.6/AG0.4

Chip Quik Inc.

2,339
SMD4300LTLFP250T4

规格书

CHIPQUIK® SMD4300 Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean, Water Soluble - - Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 32°F ~ 77°F (0°C ~ 25°C)
SMD3SWLT.040 100G

SMD3SWLT.040 100G

SN42/BI58 2.2% FLUX CORE SOLDER

Chip Quik Inc.

4,366
SMD3SWLT.040 100G

规格书

SMD3 Bulk Active Wire Solder Bi58Sn42 (58/42) 0.040" (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) - - Lead Free Spool, 3.53 oz (100g) - - -
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