通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度





























































































































































































































































































































































































































































































































全部重置
应用所有
结果:

焊料

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 成分 直径 熔点 助焊剂类型 线规 网格类型 工艺 形式 保质期 保质期起始 储存/冷藏温度
NCSWLF.015 4OZ

NCSWLF.015 4OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

4,120
NCSWLF.015 4OZ

规格书

CHIPQUIK® Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015" (0.38mm) 423 ~ 428°F (217 ~ 220°C) No-Clean - - - Spool, 4 oz (113.40g) - - -
SMD4300AX250T4

SMD4300AX250T4

SLDR PST WATR SOL 63/37 T4 250G

Chip Quik Inc.

4,542
SMD4300AX250T4

规格书

CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean, Water Soluble - 4 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
BARSN42BI57AG1

BARSN42BI57AG1

SOLDER BAR SN42/BI57/AG1 1LB SUP

Chip Quik Inc.

4,157
BARSN42BI57AG1

规格书

Super Low Dross™ Bulk Active Bar Solder Bi57Sn42Ag1 (57/42/1) - 280°F (138°C) - - - Lead Free Bar, 1 lb (454g) - - -
TS391AX250

TS391AX250

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

2,106
TS391AX250

规格书

- Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD4300SNL250T3

SMD4300SNL250T3

SOLDER PASTE SAC305 250G T3

Chip Quik Inc.

1,657
SMD4300SNL250T3

规格书

CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 3 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMDSWLF.031 8OZ

SMDSWLF.031 8OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

4,462
SMDSWLF.031 8OZ

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - - -
RASWLF.031 8OZ

RASWLF.031 8OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

4,657
RASWLF.031 8OZ

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 21 AWG, 20 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - - -
SMDSWLF.020 8OZ

SMDSWLF.020 8OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

2,104
SMDSWLF.020 8OZ

规格书

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.020" (0.51mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 24 AWG, 25 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - - -
NC191SNL250

NC191SNL250

SMOOTH FLOW LEAD-FREE SOLDER PAS

Chip Quik Inc.

1,446
NC191SNL250

规格书

Smooth Flow™ Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
NC191LT250

NC191LT250

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

4,667
NC191LT250

规格书

Smooth Flow™ Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
深圳市通胜兴电子有限公司

搜索

深圳市通胜兴电子有限公司

产品

深圳市通胜兴电子有限公司

电话

深圳市通胜兴电子有限公司

会员