通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
210931-1

210931-1

CONN SOCKET SIP GOLD

TE Connectivity AMP Connectors

4,533
210931-1

规格书

- Tape & Reel (TR) Active SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester, Glass Filled -
2134397-1

2134397-1

CONN SOCKET LGA 115POS

TE Connectivity AMP Connectors

2,208
2134397-1

规格书

LGH Bulk Active LGA 115 - - - - Surface Mount Open Frame Solder - - - - Polycarbonate Film -
D84032B-46

D84032B-46

CONN SOCKET PLCC 32POS TIN

Harwin Inc.

4,444
D84032B-46

规格书

D830 Tube Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -50°C ~ 105°C
1640258-9

1640258-9

CONN SOCKET PGA 576POS GOLD

TE Connectivity AMP Connectors

2,595

-

- - Obsolete PGA 576 (24 x 24) 0.039" (1.00mm) Gold - - Surface Mount Closed Frame Solder 0.039" (1.00mm) Gold - - Polyamide (PA), Nylon -
5-2013620-3

5-2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

2,642

-

- Bulk Obsolete PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
8-1437504-9

8-1437504-9

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

4,428
8-1437504-9

规格书

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Copper 100.0µin (2.54µm) Beryllium Copper Phenolic -55°C ~ 125°C
9-1437504-4

9-1437504-4

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

1,212
9-1437504-4

规格书

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - - - Beryllium Copper Phenolic -55°C ~ 125°C
9-1437504-8

9-1437504-8

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

3,777
9-1437504-8

规格书

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 50.0µin (1.27µm) Beryllium Copper Chassis Mount Closed Frame Solder - - - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
9-1437508-5

9-1437508-5

CONN SOCKET TRANSIST TO-5 4POS

TE Connectivity AMP Connectors

2,249

-

- Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Tin - Brass Polyamide (PA), Nylon, Glass Filled -55°C ~ 125°C
1051420432

1051420432

CONN SOCKET LGA 2011POS GOLD

Molex

2,914
1051420432

规格书

105142 Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - Copper Alloy Thermoplastic -
APA-308-G-K

APA-308-G-K

ADAPTER PLUG

Samtec Inc.

2,826
APA-308-G-K

规格书

APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-322-G-K

APA-322-G-K

ADAPTER PLUG

Samtec Inc.

4,388
APA-322-G-K

规格书

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-322-T-P

APA-322-T-P

ADAPTER PLUG

Samtec Inc.

4,461
APA-322-T-P

规格书

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-640-T-K

APA-640-T-K

ADAPTER PLUG

Samtec Inc.

4,143
APA-640-T-K

规格书

APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
540-AG11D-ES

540-AG11D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

2,333
540-AG11D-ES

规格书

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
1050282011

1050282011

CONN CAMERA SOCKET 32POS GOLD

Molex

2,235

-

105028 Bulk Obsolete Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold Flash Copper Alloy Plastic -55°C ~ 85°C
268-4204-01

268-4204-01

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

3,177

-

Textool™ Box Active - - - - - - - - - - - - - - -
2A8-4204-00

2A8-4204-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

4,181

-

Textool™ Box Discontinued at Digi-Key - - - - - - - - - - - - - - -
101-93-648-41-560000

101-93-648-41-560000

SKT IC

Mill-Max Manufacturing Corp.

2,374
101-93-648-41-560000

规格书

101 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-306-41-530000

110-88-306-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,329
110-88-306-41-530000

规格书

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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