通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
34-6511-10

34-6511-10

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

1,403
34-6511-10

规格书

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-6511-11

34-6511-11

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,000
34-6511-11

规格书

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
02-0501-30

02-0501-30

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,791
02-0501-30

规格书

501 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
03-0501-21

03-0501-21

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,956
03-0501-21

规格书

501 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
07-7XXXX-10

07-7XXXX-10

CONN SOCKET SIP 7POS TIN

Aries Electronics

4,406
07-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7XXXX-10

12-7XXXX-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,163
12-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-7XXXX-10

20-7XXXX-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,597
20-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
25-7XXXX-10

25-7XXXX-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,499
25-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
33-7XXXX-10

33-7XXXX-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

4,703
33-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
35-7XXXX-10

35-7XXXX-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

4,018
35-7XXXX-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
1109011

1109011

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics

4,981
1109011

规格书

- - Active - - - - - - - - - - - - - - -
4236-118-14

4236-118-14

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics

3,854
4236-118-14

规格书

- - Active - - - - - - - - - - - - - - -
2357-108-12

2357-108-12

EJECT-A-DP LCK/EJCT SCKT SLDR TL

Aries Electronics

3,327
2357-108-12

规格书

- - Active - - - - - - - - - - - - - - -
34-6823-90

34-6823-90

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

4,071
34-6823-90

规格书

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
1109785

1109785

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics

1,375
1109785

规格书

- - Active - - - - - - - - - - - - - - -
14-8470-10

14-8470-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

1,663
14-8470-10

规格书

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-28440-10

10-28440-10

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3,192
10-28440-10

规格书

8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-68500-10

18-68500-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

1,970
18-68500-10

规格书

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-8620-210C

08-8620-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,273
08-8620-210C

规格书

8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8300-210C

10-8300-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,456
10-8300-210C

规格书

8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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