IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
02-1518-10H CONN IC DIP SOCKET 2POS GOLD Aries Electronics	1,454	-	立即询价	规格书	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
02-1518-10T CONN IC DIP SOCKET 2POS GOLD Aries Electronics	2,684	-	立即询价	规格书	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AR 10 HGL-TT SOCKET Assmann WSW Components	4,057	-	立即询价	规格书	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR14-HZL-TT CONN IC DIP SOCKET 14POS TIN Assmann WSW Components	3,235	-	立即询价	规格书	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
232-44 CONN SOCKET PLCC 44POS TIN CNC Tech	3,002	-	立即询价	规格书	-	Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
110-87-308-41-005101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	4,307	-	立即询价	规格书	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP050-1X04-160B 1X04-160B-SIP SOCKET 4 CTS Amphenol ICC (FCI)	3,528	-	立即询价	规格书	SIP050-1x	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
AW 127-17/Z-T SOCKET 17 CONTACTS SINGLE ROW Assmann WSW Components	3,721	-	立即询价	规格书	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AR14-HZL/07-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	3,023	-	立即询价	规格书	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A22-LC-TT CONN IC DIP SOCKET 6POS TIN Assmann WSW Components	2,951	-	立即询价	规格书	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
115-87-306-41-003101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	4,688	-	立即询价	规格书	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1-1825093-1 CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	1,587	-	立即询价	规格书	Diplomate DL	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
01-0513-10H CONN SOCKET SIP 1POS GOLD Aries Electronics	4,873	-	立即询价	规格书	0513	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
02-0513-10 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,603	-	立即询价	规格书	0513	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
116-87-304-41-012101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	1,395	-	立即询价	规格书	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A28-LC-7-TT-R CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	2,166	-	立即询价	规格书	-	Box	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
HLS-2001-TT-11 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	1,648	-	立即询价	规格书	HLS	Bulk	Active	SIP	20 (20 x 1)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
4-1814655-7 CONN SOCKET SIP 5POS GOLD TE Connectivity AMP Connectors	4,742	-	立即询价	规格书	-	Bulk	Obsolete	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
AW 127-18/Z-T SOCKET 18 CONTACTS SINGLE ROW Assmann WSW Components	1,768	-	立即询价	规格书	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP050-1X05-157B 1X05-157B-SIP SOCKET 5 CTS Amphenol ICC (FCI)	1,612	-	立即询价	规格书	SIP050-1x	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-

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