IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
ICO-486-S8A-T CONN IC DIP SOCKET 48POS TIN 3M	2,663	-	立即询价	规格书	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-486-S8-T CONN IC DIP SOCKET 48POS TIN 3M	4,716	-	立即询价	规格书	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
AR08-HZL-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	2,588	-	立即询价	规格书	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AW 127-04/Z-T SOCKET 4 CONTACTS SINGLE ROW Assmann WSW Components	1,795	-	立即询价	规格书	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP1X05-011B SIP1X05-011B-SIP SOCKET 5 CTS Amphenol ICC (FCI)	4,211	-	立即询价	规格书	SIP1x	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
115-87-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,671	-	立即询价	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AW 127-09/Z-T SOCKET 9 CONTACTS SINGLE ROW Assmann WSW Components	3,721	-	立即询价	规格书	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DIP308-014B DIP SOCKET 8 CTS Amphenol ICC (FCI)	1,593	-	立即询价	规格书	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
114-87-304-41-117101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,802	-	立即询价	规格书	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICO-426-S8A-T CONN IC DIP SOCKET 42POS TIN 3M	1,233	-	立即询价	规格书	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-426-S8-T CONN IC DIP SOCKET 42POS TIN 3M	1,760	-	立即询价	规格书	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
AR 06 HGL-TT SOCKET Assmann WSW Components	4,100	-	立即询价	规格书	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
DIP308-011B DIP SOCKET 8 CTS Amphenol ICC (FCI)	2,219	-	立即询价	规格书	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP1X06-014B SIP1X06-014B-SIP SOCKET 6 CTS Amphenol ICC (FCI)	1,798	-	立即询价	规格书	SIP1x	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
WMS-080Z CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc.	1,333	-	立即询价	规格书	WMS	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
DIP306-001B SOCKET 6 CTS Amphenol ICC (FCI)	4,271	-	立即询价	规格书	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
01-0513-10 CONN SOCKET SIP 1POS GOLD Aries Electronics	4,358	-	立即询价	规格书	0513	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
01-0513-10T CONN SOCKET SIP 1POS GOLD Aries Electronics	3,978	-	立即询价	规格书	0513	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
01-0518-10 CONN SOCKET SIP 1POS GOLD Aries Electronics	1,815	-	立即询价	规格书	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
SIP050-1X03-157B 1X03-157B-SIP SOCKET 3 CTS Amphenol ICC (FCI)	4,141	-	立即询价	规格书	SIP050-1x	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-

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