13360502897
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购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SA326040CONN IC DIP SOCKET 32POS GOLD |
2,347 |
|
规格书 |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
PLCC-68-ATPLCC 68P THROUGH HOLE |
4,344 |
|
规格书 |
PLCC | Tube | Active | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
SA406040CONN IC DIP SOCKET 40POS GOLD |
1,677 |
|
规格书 |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
28-6518-10CONN IC DIP SOCKET 28POS GOLD |
2,355 |
|
规格书 |
518 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
917-43-108-41-005000CONN TRANSIST TO-5 8POS GOLD |
1,744 |
|
规格书 |
917 | Tube | Active | Transistor, TO-5 | 8 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
382CONN IC DIP SOCKET 28POS |
2,029 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
28-3518-10CONN IC DIP SOCKET 28POS GOLD |
1,001 |
|
规格书 |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
MIKROE-42540 PIN ZIF SOCKET |
3,312 |
|
规格书 |
- | Box | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | - | - | - | - | Through Hole | Closed Frame | Solder | - | - | - | - | - | - |
|
4732COVER PWR TRANS .210"ID TO-3 |
2,407 |
|
规格书 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
224-1286-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
4,654 |
|
规格书 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
224-5248-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
1,041 |
|
规格书 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD |
2,716 |
|
规格书 |
Textool™ | Bulk | Active | SOIC | 14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
228-1371-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
2,805 |
|
规格书 |
Textool™ | Tray | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
216-5205-01CONN SOCKET QFN 16POS GOLD |
2,243 |
|
规格书 |
Textool™ | Bulk | Active | QFN | 16 (3x3) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
228-5204-01CONN SOCKET QFN 28POS GOLD |
3,093 |
|
规格书 |
Textool™ | Bulk | Active | QFN | 28 (4 x 7) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
115-93-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
3,735 |
|
规格书 |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
940-44-020-17-400000CONN SOCKET PLCC 20POS TIN |
4,399 |
|
规格书 |
940 | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
214-99-316-01-670800CONN IC DIP SOCKET 16POS TINLEAD |
2,490 |
|
规格书 |
214 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
XR2A-1411-NCONN IC DIP SOCKET 14POS GOLD |
1,787 |
|
规格书 |
XR2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
AR 16-HZW/TNCONN IC DIP SOCKET 16POS GOLD |
2,741 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
