IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
299-43-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,314	-	立即询价	规格书	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,839	-	立即询价	规格书	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-049-07-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,492	-	立即询价	规格书	510	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	3,806	-	立即询价	规格书	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	2,378	-	立即询价	规格书	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
44-3572-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	1,161	-	立即询价	规格书	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3573-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	4,382	-	立即询价	规格书	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
210-83-308-41-101000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,941	-	立即询价	-	210	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-308-41-530000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	3,970	-	立即询价	规格书	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-316-41-530000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	1,562	-	立即询价	-	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-318-41-530000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,093	-	立即询价	规格书	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-628-41-530000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	1,461	-	立即询价	-	110	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
CAP-002-01-00 0603 Capacitor Test Socket MiS Technologies	1,534	-	立即询价	规格书	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S582-11-898-15-001414 898 POS BGA SOCKET .050 Mill-Max Manufacturing Corp.	1,660	-	立即询价	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S530-10-898-15-001406 898 POS BGA HEADER .050 Mill-Max Manufacturing Corp.	1,221	-	立即询价	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
108493-0014 DDR Socket, 96 BGA 7.5 mm x 13.1 Ironwood Electronics	2,400	-	立即询价	规格书	Grypper	Bag	Active	BGA	96 (9 x 16)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
108493-0015 DDR Socket, 96 BGA 7.5 mm x 13.1 Ironwood Electronics	2,480	-	立即询价	规格书	Grypper	Bag	Active	BGA	96 (9 x 16)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
107022-0048 DDR Socket, 78 BGA 7.5 mm x 10.6 Ironwood Electronics	4,855	-	立即询价	规格书	Grypper	Bag	Active	BGA	78 (6 x 13)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
108387-0059 Socket-eMMC/UFS, 153 BGA 10.0 mm Ironwood Electronics	4,575	-	立即询价	规格书	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-
107250-0026 Socket-eMMC/UFS, 153 BGA 11.5 mm Ironwood Electronics	2,554	-	立即询价	规格书	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-

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