IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
251-5949-02-0602 CONN ZIG-ZAG ZIF 51POS GOLD 3M	4,354	-	立即询价	规格书	Textool™	Bulk	Active	Zig-Zag, ZIF (ZIP)	51 (1 x 25, 1 x 26)	0.050" (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
361-PRS19001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	4,604	-	立即询价	规格书	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
248-4205-01 CONN SOCKET QFN 48POS GOLD 3M	2,321	-	立即询价	规格书	Textool™	Bulk	Active	QFN	48 (4 x 12)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
256-4205-01 CONN SOCKET QFN 56POS GOLD 3M	3,742	-	立即询价	规格书	Textool™	Bulk	Active	QFN	56 (4 x 14)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016" (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
280-5205-01 CONN SOCKET QFN 80POS GOLD 3M	4,923	-	立即询价	规格书	Textool™	Bulk	Active	QFN	80 (4 x 20)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020" (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
44-547-11E CONN SOCKET SOIC ZIF 44POS GOLD Aries Electronics	1,776	-	立即询价	规格书	547	Bulk	Active	SOIC, ZIF (ZIP)	44 (2 x 22)	-	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
110-47-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	373	-	立即询价	规格书	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ED020PLCZ CONN SOCKET PLCC 20POS TIN On Shore Technology Inc.	663	-	立即询价	规格书	ED	Tube	Active	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
210-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	785	-	立即询价	规格书	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
EDO-32PLCZSM CONN SOCKET PLCC 32POS On Shore Technology Inc.	712	-	立即询价	规格书	ED	Tube	Active	PLCC	32 (2 x 16)	0.050" (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 105°C
111-47-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	408	-	立即询价	规格书	111	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	377	-	立即询价	规格书	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
06-0518-10H CONN SOCKET SIP 6POS GOLD Aries Electronics	1,164	-	立即询价	规格书	518	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
8432-21A1-RK-TP CONN SOCKET PLCC 32POS TIN 3M	3,567	-	立即询价	规格书	8400	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
SA486000 CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	3,199	-	立即询价	规格书	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
115-43-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	1,012	-	立即询价	规格书	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-210-41-006000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	4,645	-	立即询价	规格书	116	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-320-STT CONN IC DIP SKT 20POS Samtec Inc.	3,425	-	立即询价	规格书	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
32-6518-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,284	-	立即询价	规格书	518	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICF-318-T-O CONN IC DIP SOCKET 18POS TIN Samtec Inc.	2,369	-	立即询价	规格书	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C

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