13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APA-640-G-PADAPTER PLUG |
2,824 |
|
规格书 |
APA | Bulk | Active | - | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
2174988-1CONN SOCKET LGA 2011POS GOLD |
3,274 |
|
规格书 |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.035" (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
6-1437522-9STAMPED PIN |
2,898 |
|
规格书 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
523-93-121-13-061001PGA SOCK 121PIN 13X13 WIRE WRAP |
295 |
|
规格书 |
523 | Bulk | Active | PGA | 121 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
|
21218NECONN IC DIP SOCKET 8POS |
2,268 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212014NECONN IC DIP SOCKET 14POS |
1,214 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212016NECONN IC DIP SOCKET 16POS |
1,364 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212024WECONN IC DIP SOCKET 24POS |
1,892 |
|
规格书 |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212114NECONN IC DIP SOCKET 14POS |
1,559 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212116NECONN IC DIP SOCKET 16POS |
1,764 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212124NECONN IC DIP SOCKET 24POS |
489 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212128NECONN IC DIP SOCKET 28POS |
1,023 |
|
规格书 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212132WECONN IC DIP SOCKET 32POS |
575 |
|
规格书 |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212140WECONN IC DIP SOCKET 40POS |
216 |
|
规格书 |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
2,010 |
|
规格书 |
800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
820-AG11D-ESL-LFIC SOCKET, DIP20, 20 CONTACT(S), |
2,010 |
|
规格书 |
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
3-1571552-2840-AG11D-ESL-LF=800 DIP GF/SN |
5,833 |
|
规格书 |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
840-AG11D-ESL-LFIC SOCKET, DIP40, 40 CONTACT(S), |
5,833 |
|
规格书 |
800 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
110-87-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
416 |
|
规格书 |
110 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
SA203000CONN IC DIP SOCKET 20POS GOLD |
645 |
|
规格书 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
