13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1981837-2CONN SOCKET LGA 1366POS GOLD |
2,983 |
|
规格书 |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
|
|
APA-316-G-NADAPTER PLUG |
3,114 |
|
规格书 |
APA | Tube | Active | - | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
ICO-640-MGT.100" LOW PROFILE SCREW MACHINE |
1,620 |
|
规格书 |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
101-93-422-41-560000CONN IC DIP SOCKET 22POS GOLD |
486 |
|
规格书 |
101 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-93-420-41-001000CONN IC DIP SOCKET 20POS GOLD |
538 |
|
规格书 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-43-632-10-002000CONN IC DIP SOCKET 32POS GOLD |
300 |
|
规格书 |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-43-424-41-003000CONN IC DIP SOCKET 24POS GOLD |
488 |
|
规格书 |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
ICF-640-S-O-TR.100" SURFACE MOUNT SCREW MACHIN |
1,761 |
|
规格书 |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
|
ICO-640-NGT.100" LOW PROFILE SCREW MACHINE |
2,946 |
|
规格书 |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
116-93-318-41-007000CONN IC DIP SOCKET 18POS GOLD |
892 |
|
规格书 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
8059-2G5CONN SOCKET TRANSIST TO-5 8POS |
4,445 |
|
规格书 |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
|
2-1437531-2CONN IC DIP SOCKET 14POS GOLD |
4,387 |
|
规格书 |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
117-93-628-41-005000CONN IC DIP SOCKET 28POS GOLD |
193 |
|
规格书 |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
3-1437508-1CONN TRANSIST TO-5 8POS GOLD |
3,603 |
|
规格书 |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
2-822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
3,852 |
|
规格书 |
- | Tube | Obsolete | QFP | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
2201838-2CONN SOCKET LGA 2011POS GOLD |
3,453 |
|
规格书 |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | - |
|
|
2201838-1CONN SOCKET LGA 2011POS GOLD |
4,709 |
|
规格书 |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
ASPI0002-P001ASPI 8Pin WSON 8X6 |
3,430 |
|
规格书 |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ASPI0001-P001ASPI 8 PIN_IC 150mil |
1,710 |
|
规格书 |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ACA-SPI-004-K01SPI 8 PIN_IC 208mil |
1,660 |
|
规格书 |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
