13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-87-650-41-005101CONN IC DIP SOCKET 50POS GOLD |
3,745 |
|
规格书 |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ICF-308-TM-I-TR.100" SMT SCREW MACHINE DIP SOCK |
4,867 |
|
规格书 |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
115-83-328-41-003101CONN IC DIP SOCKET 28POS GOLD |
4,102 |
|
规格书 |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
121-83-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
4,906 |
|
规格书 |
121 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
299-87-608-10-002101CONN IC DIP SOCKET 8POS GOLD |
3,228 |
|
规格书 |
299 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0205-TT-12.100" SCREW MACHINE SOCKET ARRAY |
4,421 |
|
规格书 |
HLS | Tube | Active | SIP | 10 (2 x 5) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
|
540-44-068-17-400000CONN SOCKET PLCC 68POS TIN |
3,421 |
|
规格书 |
540 | Tube | Obsolete | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | -55°C ~ 125°C |
|
|
20-3513-10CONN IC DIP SOCKET 20POS GOLD |
2,842 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
117-83-430-41-005101CONN IC DIP SOCKET 30POS GOLD |
2,949 |
|
规格书 |
117 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 30 (2 x 15) | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
2-1437537-1CONN IC DIP SOCKET 14POS GOLD |
1,220 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
116-83-422-41-006101CONN IC DIP SOCKET 22POS GOLD |
4,251 |
|
规格书 |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
4-1571551-5CONN IC DIP SOCKET 18POS GOLD |
4,598 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
300-032-050CONN SOCKET SIP 32POS GOLD |
1,235 |
|
- |
300 | Box | Obsolete | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | - |
|
116-87-322-41-002101CONN IC DIP SOCKET 22POS GOLD |
3,384 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
4,213 |
|
规格书 |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
C9314-02CONN IC DIP SOCKET 14POS GOLD |
1,916 |
|
规格书 |
Lo-PRO®file, C93 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
08-6513-10HCONN IC DIP SOCKET 8POS GOLD |
3,940 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
14-3518-11CONN IC DIP SOCKET 14POS GOLD |
4,954 |
|
规格书 |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
110-83-320-41-105191CONN IC DIP SOCKET 20POS GOLD |
3,949 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
123-87-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
3,884 |
|
规格书 |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
