13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-83-316-41-008101CONN IC DIP SOCKET 16POS GOLD |
2,319 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
HLS-0105-T-19.100" SCREW MACHINE SOCKET ARRAY |
3,128 |
|
规格书 |
HLS | Tube | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
116-87-428-41-018101CONN IC DIP SOCKET 28POS GOLD |
3,682 |
|
规格书 |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
146-83-316-41-035101CONN IC DIP SOCKET 16POS GOLD |
4,029 |
|
规格书 |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
146-83-316-41-036101CONN IC DIP SOCKET 16POS GOLD |
4,099 |
|
规格书 |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICO-308-NTT.100" LOW PROFILE SCREW MACHINE |
3,407 |
|
规格书 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
14-6513-10CONN IC DIP SOCKET 14POS GOLD |
3,739 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
18-0518-11CONN SOCKET SIP 18POS GOLD |
3,477 |
|
规格书 |
518 | Bulk | Active | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
HLS-0107-T-2.100" SCREW MACHINE SOCKET ARRAY |
1,167 |
|
规格书 |
HLS | Tube | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
110-87-432-41-105101CONN IC DIP SOCKET 32POS GOLD |
2,403 |
|
规格书 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICF-318-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
3,517 |
|
- |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
|
ICF-318-T-O-TR.100" SURFACE MOUNT SCREW MACHIN |
1,374 |
|
规格书 |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
|
ICO-314-LTT.100" LOW PROFILE SCREW MACHINE |
3,320 |
|
规格书 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
122-83-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
3,479 |
|
规格书 |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
123-83-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
2,434 |
|
规格书 |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-314-41-004101CONN IC DIP SOCKET 14POS GOLD |
4,733 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
114-87-640-41-117101CONN IC DIP SOCKET 40POS GOLD |
3,366 |
|
规格书 |
114 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
114-87-640-41-134161CONN IC DIP SOCKET 40POS GOLD |
1,630 |
|
规格书 |
114 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
06-2513-10HCONN IC DIP SOCKET 6POS GOLD |
1,053 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
12-3513-11CONN IC DIP SOCKET 12POS GOLD |
3,376 |
|
规格书 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
