13360502897
BOM
购物车传感器和探测器接口
| 图片 | 型号 | 库存 | 数量 | 规格书 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 类型 | 输入类型 | 输出类型 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZSSC3241DI1CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
2,563 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
3,504 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
4,831 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI5CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
4,646 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL1BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
3,738 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI1BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
3,752 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL5CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
2,547 |
|
规格书 |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3240CC6BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
1,382 |
|
规格书 |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
|
|
ZSSC3240CC5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
2,928 |
|
规格书 |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
|
|
ZSSC3240CC2BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
1,494 |
|
规格书 |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
