通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-13-144-12-000012

614-13-144-12-000012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,212
614-13-144-12-000012

规格书

614 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-223-18-098012

614-13-223-18-098012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,490
614-13-223-18-098012

规格书

614 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-225-18-091007

614-13-225-18-091007

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,816
614-13-225-18-091007

规格书

614 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-400-20-000001

614-13-400-20-000001

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,609
614-13-400-20-000001

规格书

614 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-241-18-075012

614-93-241-18-075012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,600
614-93-241-18-075012

规格书

614 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-084-17-400004

940-44-084-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

4,171
940-44-084-17-400004

规格书

940 Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
D01-9933201

D01-9933201

CONNECTOR

Harwin Inc.

2,058
D01-9933201

规格书

D01-993 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100" (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
8114LB603G

8114LB603G

HEATSINK

Boyd Laconia, LLC

4,776

-

- - Active - - - - - - - - - - - - - - -
PX-20LCC

PX-20LCC

LEADLESS CHIP CARRIER 20P PBT RO

Kycon, Inc.

4,708

-

PX Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-28LCC

PX-28LCC

LEADLESS CHIP CARRIER 28P PBT RO

Kycon, Inc.

4,212

-

PX Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-32LCC

PX-32LCC

LEADLESS CHIP CARRIER 32P PBT RO

Kycon, Inc.

1,937

-

PX Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-44LCC

PX-44LCC

LEADLESS CHIP CARRIER 44P PBT RO

Kycon, Inc.

4,047

-

PX Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-52LCC

PX-52LCC

LEADLESS CHIP CARRIER 52P PBT RO

Kycon, Inc.

1,427

-

PX Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-68LCC

PX-68LCC

LEADLESS CHIP CARRIER 68P PBT RO

Kycon, Inc.

1,994

-

PX Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-84LCC

PX-84LCC

LEADLESS CHIP CARRIER 84P PBT RO

Kycon, Inc.

4,688

-

PX Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
2255-929A-90-2401

2255-929A-90-2401

CONN TEST & BURN-IN BGA SOCKET

3M

4,461

-

- Bulk Obsolete - - - - - - - - - - - - - - -
2320-9220-02-2401

2320-9220-02-2401

CONN TEST & BURN-IN BGA SOCKET

3M

3,241

-

- Bulk Obsolete - - - - - - - - - - - - - - -
2432-9235-01-2401

2432-9235-01-2401

CONN TEST & BURN-IN BGA SOCKET

3M

1,823

-

- Bulk Obsolete - - - - - - - - - - - - - - -
2256-6321-9UA-1902

2256-6321-9UA-1902

GRID ZIP 21 X 21

3M

2,394
2256-6321-9UA-1902

规格书

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
276-6321-9UA-1902

276-6321-9UA-1902

TEST BURN-IN PGA

3M

1,498
276-6321-9UA-1902

规格书

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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