13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
220-2600-50-06023M TEXTOOL ZIP STRIP SOCKETS 220 |
4,586 |
|
- |
Textool™ | Box | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
518-77-256M16-000105CONN SOCKET PGA 256POS GOLD |
2,093 |
|
规格书 |
518 | Bulk | Active | PGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-256M20-001105CONN SOCKET PGA 256POS GOLD |
3,704 |
|
规格书 |
518 | Bulk | Active | PGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD |
3,245 |
|
规格书 |
514 | Bulk | Active | BGA | 400 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-292M20-001152BGA SOLDER TAIL |
4,112 |
|
规格书 |
550 | Bulk | Active | BGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
APH-1136-G-RAPH-1136-G-R |
1,824 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1236-G-RAPH-1236-G-R |
3,784 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1736-G-RAPH-1736-G-R |
4,452 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1336-G-RAPH-1336-G-R |
1,905 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
550-10-420M26-001166BGA PIN ADAPTER 1.27MM SMD |
3,170 |
|
规格书 |
550 | Bulk | Active | BGA | 420 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
2100-7243-00-1807CONN SOCKET PQFP 100POS TIN-LEAD |
1,135 |
|
规格书 |
OEM | Bulk | Obsolete | QFP | 100 (4 x 25) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | 0°C ~ 105°C |
|
|
614-87-296-19-131144CONN SOCKET PGA 296POS GOLD |
3,167 |
|
规格书 |
614 | Bulk | Active | PGA | 296 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-447-20-121147CONN SOCKET PGA 447POS GOLD |
3,428 |
|
规格书 |
546 | Bulk | Active | PGA | 447 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-255M16-001106CONN SOCKET PGA 255POS GOLD |
2,642 |
|
规格书 |
518 | Bulk | Active | PGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
239-5605-02-0602CONN ZIG-ZAG 39POS GOLD |
1,927 |
|
规格书 |
- | Bulk | Obsolete | Zig-Zag | 39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
|
|
510-91-324-18-000001SKT PGA SOLDRTL |
4,709 |
|
规格书 |
510 | Bulk | Active | PGA | 324 (18 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
518-77-256M16-000106CONN SOCKET PGA 256POS GOLD |
4,763 |
|
规格书 |
518 | Bulk | Active | PGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-256M20-001106CONN SOCKET PGA 256POS GOLD |
4,689 |
|
规格书 |
518 | Bulk | Active | PGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
64-9503-21CONN IC DIP SOCKET 64POS GOLD |
4,157 |
|
规格书 |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
64-9503-31CONN IC DIP SOCKET 64POS GOLD |
1,720 |
|
规格书 |
503 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
