IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
110-13-952-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,758	-	立即询价	-	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
42-6556-31 CONN IC DIP SOCKET 42POS GOLD Aries Electronics	3,834	-	立即询价	规格书	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
42-6556-21 CONN IC DIP SOCKET 42POS GOLD Aries Electronics	3,898	-	立即询价	规格书	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
714-43-262-31-018000 CONN IC DIP SOCKET 62POS GOLD Mill-Max Manufacturing Corp.	2,987	-	立即询价	规格书	714	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	62 (2 x 31)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-648-G-C ADAPTER PLUG Samtec Inc.	2,244	-	立即询价	规格书	APA	Bulk	Active	-	48 (2 x 24)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APH-0432-G-H APH-0432-G-H Samtec Inc.	1,257	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0532-G-H APH-0532-G-H Samtec Inc.	2,555	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0632-G-H APH-0632-G-H Samtec Inc.	4,004	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0232-G-H APH-0232-G-H Samtec Inc.	3,355	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1332-G-H APH-1332-G-H Samtec Inc.	3,763	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0732-G-H APH-0732-G-H Samtec Inc.	3,751	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1132-G-H APH-1132-G-H Samtec Inc.	2,466	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1232-G-H APH-1232-G-H Samtec Inc.	4,078	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1732-G-H APH-1732-G-H Samtec Inc.	3,991	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1632-G-H APH-1632-G-H Samtec Inc.	2,721	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
117-93-764-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,635	-	立即询价	-	117	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-13-064-08-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,011	-	立即询价	规格书	510	Bulk	Active	PGA	64 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APO-640-G-H .100" LOW PROFILE SCREW MACHINE Samtec Inc.	3,150	-	立即询价	规格书	APO	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APH-1024-G-H APH-1024-G-H Samtec Inc.	4,719	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1124-G-H APH-1124-G-H Samtec Inc.	1,146	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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