IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
APH-1428-G-R APH-1428-G-R Samtec Inc.	2,694	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1528-G-R APH-1528-G-R Samtec Inc.	3,410	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0628-G-R APH-0628-G-R Samtec Inc.	3,968	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0828-G-R APH-0828-G-R Samtec Inc.	4,611	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1128-G-R APH-1128-G-R Samtec Inc.	2,150	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0228-G-R APH-0228-G-R Samtec Inc.	3,919	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1328-G-R APH-1328-G-R Samtec Inc.	4,144	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1228-G-R APH-1228-G-R Samtec Inc.	3,966	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0728-G-R APH-0728-G-R Samtec Inc.	2,398	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
517-83-372-19-111111 CONN SOCKET PGA 372POS GOLD Preci-Dip	3,091	-	立即询价	规格书	517	Bulk	Active	PGA	372 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
546-83-225-18-091135 CONN SOCKET PGA 225POS GOLD Preci-Dip	3,262	-	立即询价	规格书	546	Bulk	Active	PGA	225 (18 x 18)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
546-83-225-18-091136 CONN SOCKET PGA 225POS GOLD Preci-Dip	2,036	-	立即询价	规格书	546	Bulk	Active	PGA	225 (18 x 18)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
123-11-952-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,397	-	立即询价	规格书	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-648-G-N ADAPTER PLUG Samtec Inc.	1,878	-	立即询价	规格书	APA	Tube	Active	-	48 (2 x 24)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
550-10-272M20-001166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	2,196	-	立即询价	规格书	550	Bulk	Active	BGA	272 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
110-13-324-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,350	-	立即询价	-	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2-821949-5 CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors	2,161	-	立即询价	规格书	-	Tube	Obsolete	QFP	132 (4 x 33)	0.050" (1.27mm)	Tin-Lead	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	200.0µin (5.08µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
APH-1822-G-H APH-1822-G-H Samtec Inc.	4,757	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0922-G-H APH-0922-G-H Samtec Inc.	4,304	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1922-G-H APH-1922-G-H Samtec Inc.	2,246	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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