IC 插座

型号	库存	价格	数量	规格书	系列	包装	产品状态	类型	位置或引脚数量（网格）	配对间距	触点表面处理 - 配对	触点表面处理厚度 - 配对部分	触点材料 - 配对部分	安装类型	特性	端接方式	引脚间距	触点表面处理 - 引脚	触点表面处理厚度 - 引脚	触点材料 - 引脚	外壳材料	工作温度
123-13-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	4,337	-	立即询价	规格书	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-41-084-10-031001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	4,538	-	立即询价	规格书	510	Bulk	Active	PGA	84 (10 x 10)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
514-87-281-19-081117 CONN SOCKET PGA 281POS GOLD Preci-Dip	4,680	-	立即询价	规格书	514	Bulk	Active	PGA	281 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
714-43-252-31-018000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	4,787	-	立即询价	规格书	714	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
36-6503-31 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	4,895	-	立即询价	规格书	503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
110-41-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,115	-	立即询价	-	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-650-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,889	-	立即询价	-	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-652-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,100	-	立即询价	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-648-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,836	-	立即询价	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-91-085-11-041003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	1,878	-	立即询价	规格书	510	Bulk	Active	PGA	85 (11 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-43-648-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,884	-	立即询价	-	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
517-83-364-17-091111 CONN SOCKET PGA 364POS GOLD Preci-Dip	4,787	-	立即询价	规格书	517	Bulk	Active	PGA	364 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
122-11-952-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,282	-	立即询价	规格书	122	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-83-168-17-101112 CONN SOCKET PGA 168POS GOLD Preci-Dip	1,049	-	立即询价	规格书	614	Bulk	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
40-C182-20 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,402	-	立即询价	规格书	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
APH-0428-G-T APH-0428-G-T Samtec Inc.	3,864	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0528-G-T APH-0528-G-T Samtec Inc.	3,111	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0928-G-T APH-0928-G-T Samtec Inc.	2,966	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0628-G-T APH-0628-G-T Samtec Inc.	4,498	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1228-G-T APH-1228-G-T Samtec Inc.	4,592	-	立即询价	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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