通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-91-950-41-007000

116-91-950-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,977
116-91-950-41-007000

规格书

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0220-G-12

HLS-0220-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,056
HLS-0220-G-12

规格书

HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
110-93-064-01-505000

110-93-064-01-505000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,348
110-93-064-01-505000

规格书

110 Tube Active - 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - - -
44-6556-11

44-6556-11

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2,575
44-6556-11

规格书

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
605-93-648-11-480000

605-93-648-11-480000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

2,829
605-93-648-11-480000

规格书

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-648-11-480000

605-43-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

1,422
605-43-648-11-480000

规格书

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-210-61-001000

110-13-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,623

-

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-320-41-801000

123-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,851
123-13-320-41-801000

规格书

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-6508-211

24-6508-211

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,386
24-6508-211

规格书

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-6508-311

24-6508-311

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,377
24-6508-311

规格书

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-210-61-003000

116-43-210-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,729

-

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-210-61-003000

116-93-210-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,512

-

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6503-31

28-6503-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,375
28-6503-31

规格书

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APA-422-G-M

APA-422-G-M

ADAPTER PLUG

Samtec Inc.

1,340
APA-422-G-M

规格书

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1836-T-T

APH-1836-T-T

APH-1836-T-T

Samtec Inc.

2,577

-

* - Active - - - - - - - - - - - - - - -
APH-1436-T-T

APH-1436-T-T

APH-1436-T-T

Samtec Inc.

3,863

-

* - Active - - - - - - - - - - - - - - -
APH-1636-T-T

APH-1636-T-T

APH-1636-T-T

Samtec Inc.

2,585

-

* - Active - - - - - - - - - - - - - - -
APH-0836-T-T

APH-0836-T-T

APH-0836-T-T

Samtec Inc.

4,336

-

* - Active - - - - - - - - - - - - - - -
APH-1736-T-T

APH-1736-T-T

APH-1736-T-T

Samtec Inc.

4,928

-

* - Active - - - - - - - - - - - - - - -
116-93-636-41-001000

116-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

2,631
116-93-636-41-001000

规格书

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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