通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-43-632-41-801000

110-43-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,088
110-43-632-41-801000

规格书

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

3,647
37-0501-20

规格书

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
37-0501-30

37-0501-30

CONN SOCKET SIP 37POS TIN

Aries Electronics

2,970
37-0501-30

规格书

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-41-648-41-008000

116-41-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,911
116-41-648-41-008000

规格书

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-648-41-008000

116-91-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,645
116-91-648-41-008000

规格书

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-306-61-001000

115-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,492

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-306-61-001000

115-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,525

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-950-41-001000

115-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

1,149
115-93-950-41-001000

规格书

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-950-41-001000

115-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,171
115-43-950-41-001000

规格书

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-424-41-001000

123-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,408
123-13-424-41-001000

规格书

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-432-41-002000

124-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,530
124-41-432-41-002000

规格书

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-632-41-002000

124-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,423
124-41-632-41-002000

规格书

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-432-41-002000

124-91-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,529
124-91-432-41-002000

规格书

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-632-41-002000

124-91-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,374
124-91-632-41-002000

规格书

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1832-T-T

APH-1832-T-T

APH-1832-T-T

Samtec Inc.

4,285

-

* - Active - - - - - - - - - - - - - - -
APH-0532-T-T

APH-0532-T-T

APH-0532-T-T

Samtec Inc.

2,304

-

* - Active - - - - - - - - - - - - - - -
APH-0932-T-T

APH-0932-T-T

APH-0932-T-T

Samtec Inc.

1,664

-

* - Active - - - - - - - - - - - - - - -
APH-0632-T-T

APH-0632-T-T

APH-0632-T-T

Samtec Inc.

4,409

-

* - Active - - - - - - - - - - - - - - -
APH-0332-T-T

APH-0332-T-T

APH-0332-T-T

Samtec Inc.

4,052

-

* - Active - - - - - - - - - - - - - - -
APH-0832-T-T

APH-0832-T-T

APH-0832-T-T

Samtec Inc.

2,036

-

* - Active - - - - - - - - - - - - - - -
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