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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
115-43-328-61-003000

115-43-328-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,137

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-328-61-001000

115-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,209

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-648-MGG

ICO-648-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,632
ICO-648-MGG

规格书

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
121-PGM13012-10

121-PGM13012-10

CONN SOCKET PGA GOLD

Aries Electronics

2,536
121-PGM13012-10

规格书

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
315-13-132-41-001000

315-13-132-41-001000

SOCKET LOW PROFILE SIP 32POS

Mill-Max Manufacturing Corp.

1,785

-

315 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
30-7360-10

30-7360-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

4,316
30-7360-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7365-10

30-7365-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3,228
30-7365-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7374-10

30-7374-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

2,191
30-7374-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7375-10

30-7375-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

4,270
30-7375-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7400-10

30-7400-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

1,779
30-7400-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7430-10

30-7430-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3,085
30-7430-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7435-10

30-7435-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

1,087
30-7435-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7437-10

30-7437-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3,180
30-7437-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7472-10

30-7472-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3,641
30-7472-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7920-10

30-7920-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3,665
30-7920-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-7970-10

30-7970-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

2,404
30-7970-10

规格书

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
126-93-210-41-003000

126-93-210-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

4,027
126-93-210-41-003000

规格书

126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-210-41-003000

126-43-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,920
126-43-210-41-003000

规格书

126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-13-318-41-001000

612-13-318-41-001000

SOCKET CARRIER SLDRTL .300 18POS

Mill-Max Manufacturing Corp.

2,523
612-13-318-41-001000

规格书

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-432-41-007000

116-93-432-41-007000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,852
116-93-432-41-007000

规格书

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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