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购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-382470-4CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,725 |
|
规格书 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
345725-5CONN IC DIP SOCKET 22POS TINLEAD TE Connectivity AMP Connectors |
2,011 |
|
- |
- | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | - | - | - |
|
824-AG31D-ESL-LFCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
4,784 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
1-1437537-9CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
1,110 |
|
规格书 |
800 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | - | - |
|
|
1-1437542-1CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,468 |
|
规格书 |
700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
|
832-AG11D-ESLCONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,784 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
3-1437535-4CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors |
3,712 |
|
规格书 |
500 | Bulk | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | - | - |
|
5-1571552-0CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
1,553 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
4-1571551-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
4,662 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
2-1571551-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
4,800 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
