通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

IC 插座

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-322-STT

ICA-322-STT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,611
ICA-322-STT

规格书

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
299-83-310-10-001101

299-83-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,536
299-83-310-10-001101

规格书

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-650-41-001101

110-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

1,848
110-87-650-41-001101

规格书

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-324-41-008101

116-87-324-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,632
116-87-324-41-008101

规格书

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 40-HZL/07-TT

AR 40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

4,617
AR 40-HZL/07-TT

规格书

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-83-624-41-018101

116-83-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,190
116-83-624-41-018101

规格书

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 64-HZL/01-TT

AR 64-HZL/01-TT

SOCKET

Assmann WSW Components

2,098

-

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICO-308-ATT

ICO-308-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,923
ICO-308-ATT

规格书

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
10-2513-10H

10-2513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,321
10-2513-10H

规格书

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4513-10

22-4513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,835
22-4513-10

规格书

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-87-422-41-002101

116-87-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

1,212
116-87-422-41-002101

规格书

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-636-41-001101

612-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

4,558
612-87-636-41-001101

规格书

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-424-41-001101

122-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,154
122-87-424-41-001101

规格书

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X31-160B

SIP050-1X31-160B

1X31-160B-SIP SOCKET 31 CTS

Amphenol ICC (FCI)

4,097
SIP050-1X31-160B

规格书

SIP050-1x Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
299-83-310-11-001101

299-83-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,021
299-83-310-11-001101

规格书

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1402-T-H

APH-1402-T-H

APH-1402-T-H

Samtec Inc.

3,816

-

* - Active - - - - - - - - - - - - - - -
APH-0502-T-H

APH-0502-T-H

APH-0502-T-H

Samtec Inc.

3,017

-

* - Active - - - - - - - - - - - - - - -
APH-1002-T-H

APH-1002-T-H

APH-1002-T-H

Samtec Inc.

2,638

-

* - Active - - - - - - - - - - - - - - -
APH-0602-T-H

APH-0602-T-H

APH-0602-T-H

Samtec Inc.

3,141

-

* - Active - - - - - - - - - - - - - - -
APH-0202-T-H

APH-0202-T-H

APH-0202-T-H

Samtec Inc.

2,791

-

* - Active - - - - - - - - - - - - - - -
深圳市通胜兴电子有限公司

搜索

深圳市通胜兴电子有限公司

产品

深圳市通胜兴电子有限公司

电话

深圳市通胜兴电子有限公司

会员