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购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICA-308-ZSTT.100" SCREW MACHINE DIP SOCKET |
3,636 |
|
规格书 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
300-014-000CONN SOCKET SIP 14POS GOLD |
2,226 |
|
- |
300 | - | Obsolete | SIP | 14 (1 x 14) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | - |
|
|
13-0513-10CONN SOCKET SIP 13POS GOLD |
3,222 |
|
规格书 |
0513 | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
16-0518-10CONN SOCKET SIP 16POS GOLD |
4,434 |
|
规格书 |
518 | Bulk | Active | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
05-0517-90CCONN SOCKET SIP 5POS GOLD |
3,502 |
|
规格书 |
0517 | Bulk | Active | SIP | 5 (1 x 5) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
116-83-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
3,211 |
|
规格书 |
116 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
4,550 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
540-99-052-24-000000CONN SOCKET PLCC 52POS TIN-LEAD |
4,118 |
|
规格书 |
540 | Tube | Obsolete | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
299-83-306-11-001101CONN IC DIP SOCKET 6POS GOLD |
1,941 |
|
规格书 |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
DIP640-001BDIP640-001B-DIP SOCKET 40 CTS |
4,349 |
|
规格书 |
- | Bag | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
HLS-0103-G-31.100" SCREW MACHINE SOCKET ARRAY |
2,922 |
|
规格书 |
HLS | Tube | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
115-87-628-41-003101CONN IC DIP SOCKET 28POS GOLD |
4,566 |
|
规格书 |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
SIP050-1X19-160B1X19-160B-SIP SOCKET 19 CTS |
1,064 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
116-87-310-41-004101CONN IC DIP SOCKET 10POS GOLD |
2,622 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
10-0513-10CONN SOCKET SIP 10POS GOLD |
4,918 |
|
规格书 |
0513 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
18-3518-10TCONN IC DIP SOCKET 18POS GOLD |
3,724 |
|
规格书 |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
HLS-0106-T-2.100" SCREW MACHINE SOCKET ARRAY |
2,866 |
|
规格书 |
HLS | Tube | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
2-916783-5CONN SOCKET PGA ZIF 370POS GOLD |
2,159 |
|
规格书 |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
10-0513-11CONN SOCKET SIP 10POS GOLD |
1,199 |
|
规格书 |
0513 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
17-0518-10TCONN SOCKET SIP 17POS GOLD |
2,519 |
|
规格书 |
518 | Bulk | Active | SIP | 17 (1 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
