13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
12-0518-10HCONN SOCKET SIP 12POS GOLD |
1,805 |
|
规格书 |
518 | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
12-1518-10HCONN IC DIP SOCKET 12POS GOLD |
4,304 |
|
规格书 |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
13-0518-10TCONN SOCKET SIP 13POS GOLD |
3,105 |
|
规格书 |
518 | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
A32-LCG-T-RCONN IC DIP SOCKET 32POS GOLD |
1,612 |
|
规格书 |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
ED052PLCZCONN SOCKET PLCC 52POS TIN |
1,747 |
|
规格书 |
ED | Tube | Active | PLCC | 52 (2 x 26) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
|
SIP050-1X15-160B1X15-160B-SIP SOCKET 15 CTS |
2,901 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
540-88-020-17-400CONN SOCKET PLCC 20POS TIN |
4,263 |
|
规格书 |
540 | Bulk | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | - |
|
114-83-316-41-117101CONN IC DIP SOCKET 16POS GOLD |
3,613 |
|
规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
114-83-316-41-134161CONN IC DIP SOCKET 16POS GOLD |
4,277 |
|
规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
1,546 |
|
规格书 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-312-41-018101CONN IC DIP SOCKET 12POS GOLD |
1,898 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ED028PLCZCONN SOCKET PLCC 28POS TIN |
3,852 |
|
规格书 |
ED | Tube | Active | PLCC | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
|
AW 127-32/Z-TSOCKET 32 CONTACTS SINGLE ROW |
4,568 |
|
规格书 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
506-AG11DCONN IC DIP SOCKET 6POS GOLD |
2,284 |
|
规格书 |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
299-87-306-10-001101CONN IC DIP SOCKET 6POS GOLD |
4,717 |
|
规格书 |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-318-41-105161CONN IC DIP SOCKET 18POS GOLD |
3,735 |
|
规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
122-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
3,522 |
|
规格书 |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ED084PLCZ-SM-NCONN SOCKET PLCC 84POS |
1,405 |
|
规格书 |
ED | Tube | Active | PLCC | 84 (2x42) | 0.050" (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -55°C ~ 105°C |
|
116-87-318-41-006101CONN IC DIP SOCKET 18POS GOLD |
3,462 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
114-87-320-41-134191CONN IC DIP SOCKET 20POS GOLD |
4,095 |
|
规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
