13360502897
BOM
购物车IC 插座
| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
123-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
4,961 |
|
规格书 |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
AR 10-HZW/TNCONN IC DIP SOCKET 4POS TIN |
4,840 |
|
规格书 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
114-87-314-41-117101CONN IC DIP SOCKET 14POS GOLD |
4,316 |
|
规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
114-87-314-41-134161CONN IC DIP SOCKET 14POS GOLD |
2,063 |
|
规格书 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
231-32CONN SOCKET PLCC 32POS GOLD |
4,368 |
|
规格书 |
- | Tube | Obsolete | PLCC | 32 (4 x 8) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
SIP050-1X10-157B1X10-157B-SIP SOCKET 10 CTS |
2,652 |
|
规格书 |
SIP050-1x | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
AR 50-HZL-TTSOCKET |
3,154 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
DILB42P-223TLFCONN IC DIP SOCKET 42POS TINLEAD |
2,817 |
|
规格书 |
DILB | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
|
116-87-310-41-018101CONN IC DIP SOCKET 10POS GOLD |
3,623 |
|
规格书 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
4,665 |
|
规格书 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
SIP1X20-011BSIP1X20-011B-SIP SOCKET 20 CTS |
3,458 |
|
规格书 |
SIP1x | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
917-83-103-41-005101CONN TRANSIST TO-5 3POS GOLD |
2,293 |
|
规格书 |
917 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
917-83-103-41-053101CONN TRANSIST TO-5 3POS GOLD |
4,093 |
|
规格书 |
917 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
6-513-10CONN SOCKET SIP 6POS GOLD |
4,588 |
|
规格书 |
0513 | Bulk | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
614-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
1,660 |
|
规格书 |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-314-10-002101CONN IC DIP SOCKET 14POS GOLD |
1,535 |
|
规格书 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7), 8 Loaded | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
115-83-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
1,699 |
|
- |
115 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
115-83-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
2,888 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
121-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
4,343 |
|
规格书 |
121 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
A-CCS 032-Z-SM/TIC SOCKET, CHIP CARRIER, 1.27MM, |
4,051 |
|
规格书 |
- | Tape & Reel (TR) | Active | PLCC | 32 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
