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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
01-0508-20

01-0508-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

1,510
01-0508-20

规格书

508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
01-0508-30

01-0508-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,009
01-0508-30

规格书

508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
AW 127-30/Z-T

AW 127-30/Z-T

SOCKET 30 CONTACTS SINGLE ROW

Assmann WSW Components

1,518
AW 127-30/Z-T

规格书

- - Active - - - - - - - - - - - - - - -
AJ 28-LC

AJ 28-LC

SOCKET

Assmann WSW Components

1,564

-

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
116-87-304-41-011101

116-87-304-41-011101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,264
116-87-304-41-011101

规格书

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PRT-07939

PRT-07939

DIP SOCKETS SOLDER TAIL - 14-PIN

SparkFun Electronics

1,628

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - - Through Hole Open Frame Solder - - - - - -
PRT-07938

PRT-07938

DIP SOCKETS SOLDER TAIL - 16-PIN

SparkFun Electronics

4,350

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - - Through Hole Open Frame Solder - - - - - -
HLS-0103-TT-10

HLS-0103-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,868
HLS-0103-TT-10

规格书

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-87-314-41-605101

110-87-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,288
110-87-314-41-605101

规格书

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR28-HZL-TT

AR28-HZL-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

1,837
AR28-HZL-TT

规格书

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS20-Z-R

A-CCS20-Z-R

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

4,320
A-CCS20-Z-R

规格书

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
115-83-308-41-001101

115-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,093

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-008101

116-83-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,502
116-83-304-41-008101

规格书

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

1,232
05-0518-10H

规格书

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-1518-10

06-1518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

4,655
06-1518-10

规格书

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0513-10T

04-0513-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,579
04-0513-10T

规格书

0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
808-AG11D-ES

808-AG11D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

1,933
808-AG11D-ES

规格书

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
SBU130Z

SBU130Z

CONN SOCKET SIP 13POS GOLD

On Shore Technology Inc.

4,927
SBU130Z

规格书

SBU Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
02-0513-11

02-0513-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,836
02-0513-11

规格书

0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-83-306-41-105101

110-83-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,402
110-83-306-41-105101

规格书

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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