通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

RFI 和 EMI - 接触件、弹性条和垫圈

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
4186PA51H00100

4186PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,792
4186PA51H00100

规格书

51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 1.000" (25.40mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10117780-001LF

10117780-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

2,507
10117780-001LF

规格书

- Tape & Reel (TR) Active Fingerstock - 0.236" (6.00mm) 0.268" (6.80mm) 0.083" (2.10mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4052AC51H00071

4052AC51H00071

RFI FOF GASKET PU ADH

Laird Technologies EMI

4,159
4052AC51H00071

规格书

51H Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 0.710" (18.03mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10121135-001LF

10121135-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

4,276
10121135-001LF

规格书

- Tube Obsolete Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.138" (3.50mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4520PA51G00100

4520PA51G00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,903

-

51G Bulk Active Fabric Over Foam Square 0.080" (2.03mm) 1.000" (25.40mm) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
120220-0313

120220-0313

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

1,689
120220-0313

规格书

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.147" (3.73mm) 0.118" (3.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
67SLA060080070PI00

67SLA060080070PI00

SLA W6XH8XL7MM

Laird Technologies EMI

3,734

-

SMD Contact Bulk Obsolete - - - - - - - - - -
120220-0315

120220-0315

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

4,605
120220-0315

规格书

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.157" (3.99mm) 0.157" (4.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
1-1447360-1

1-1447360-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

2,823
1-1447360-1

规格书

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.138" (3.50mm) 0.055" (1.40mm) Copper Alloy Gold 1.967µin (0.05µm) Solder -
1554825-1

1554825-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

3,301
1554825-1

规格书

- Bag Active Shield Finger, Pre-Loaded - 0.045" (1.15mm) 0.094" (2.40mm) 0.051" (1.30mm) Copper Alloy Gold Flash Solder -
BMI-C-001-SN

BMI-C-001-SN

RFI SHLD FINGER BECU TIN SOLDER

Laird Technologies EMI

3,034
BMI-C-001-SN

规格书

BMI-C Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.122" (3.11mm) 0.096" (2.44mm) Beryllium Copper Tin - Solder -
10103958-001LF

10103958-001LF

RFI FINGERSTOCK CU TIN

Amphenol ICC (FCI)

4,270
10103958-001LF

规格书

- Tape & Reel (TR) Active Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.132" (3.35mm) Copper Alloy Tin 30.0µin (0.76µm) - -
4912PA51H00100

4912PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,248

-

51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67BCG2504303510R00

67BCG2504303510R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

2,429
67BCG2504303510R00

规格书

BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
4157PA51H00100

4157PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,404

-

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
SMG118157R-0.197

SMG118157R-0.197

RFI FILM OVER FOAM PU

Leader Tech Inc.

2,734
SMG118157R-0.197

规格书

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.157" (4.00mm) 0.197" (5.00mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
SMG256197R-0.118

SMG256197R-0.118

RFI FILM OVER FOAM PU

Leader Tech Inc.

4,456
SMG256197R-0.118

规格书

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.197" (5.00mm) 0.256" (6.50mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
67BCG2003201508R00

67BCG2003201508R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

1,079
67BCG2003201508R00

规格书

BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
10116189-001LF

10116189-001LF

RFI FINGERSTOCK CU GOLD

Amphenol ICC (FCI)

3,029
10116189-001LF

规格书

- Tape & Reel (TR) Active Fingerstock - - - - Copper Alloy Gold 3.00µin (0.076µm) - -
67B5N4004005108R00

67B5N4004005108R00

SP,CON,TNR 5.10X4.00X4.00MM

Laird Technologies EMI

2,909

-

- Cut Tape (CT) Active - - - - - - - - - -
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