通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

RFI 和 EMI - 接触件、弹性条和垫圈

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 形状 宽度 长度 高度 材质 电镀 电镀 - 厚度 附件方式 工作温度
67SLG060080070PI00

67SLG060080070PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

2,594
67SLG060080070PI00

规格书

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.236" (6.00mm) 0.276" (7.00mm) 0.315" (8.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
0097048917

0097048917

RFI FINGERSTOCK TIN

Laird Technologies EMI

1,787

-

- Bulk Active Fingerstock - - - - - Tin 299.21µin (7.60µm) - 121°C
4202PA51G00400

4202PA51G00400

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,164

-

51G Bulk Active Fabric Over Foam D-Shape 0.250" (6.35mm) 4.000" (101.60mm) 0.120" (3.05mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
67SLH050050025PI00

67SLH050050025PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

3,894
67SLH050050025PI00

规格书

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.098" (2.50mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
0097078702

0097078702

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

4,397
0097078702

规格书

IEEE 1394 Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
4358AB51K01200

4358AB51K01200

RFI FOF GASKET PU

Laird Technologies EMI

3,832
4358AB51K01200

规格书

51K Bulk Active Fabric Over Foam D-Shape 0.098" (2.50mm) 12.000" (304.80mm) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4693PA51H00400

4693PA51H00400

RFI FOF GASKET PU ADH

Laird Technologies EMI

4,664
4693PA51H00400

规格书

51H Bulk Active Fabric Over Foam Rectangle 0.190" (4.83mm) 4.000" (101.60mm) 0.130" (3.30mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
4056AB51K00900

4056AB51K00900

RFI FOF GASKET PU

Laird Technologies EMI

3,025
4056AB51K00900

规格书

51K Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 9.000" (228.60mm) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4209AJ51H01100

4209AJ51H01100

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,429

-

51H Bulk Active Fabric Over Foam Rectangle 0.155" (3.94mm) 11.000" (279.40mm) 0.120" (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
4418AB51K01000

4418AB51K01000

RFI FOF GASKET PU ADH

Laird Technologies EMI

4,071
4418AB51K01000

规格书

51K Bulk Active Fabric Over Foam - - 10.000" (254.00mm) - Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
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