通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 接口 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装





































































































































































































































































































































































































































































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结果:

I/O 扩展器

图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 接口 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MCP23008T-E/SO

MCP23008T-E/SO

IC XPNDR 1.7MHZ I2C 18SOIC

Microchip Technology

8,729
MCP23008T-E/SO

规格书

- 18-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 18-SOIC
MCP23008-E/SO

MCP23008-E/SO

IC XPNDR 1.7MHZ I2C 18SOIC

Microchip Technology

1,559
MCP23008-E/SO

规格书

- 18-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 18-SOIC
MCP23008T-E/SS

MCP23008T-E/SS

IC XPNDR 1.7MHZ I2C 20SSOP

Microchip Technology

15,006
MCP23008T-E/SS

规格书

- 20-SSOP (0.209", 5.30mm Width) Tape & Reel (TR) Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-SSOP
MCP23S17-E/SS

MCP23S17-E/SS

IC XPNDR 10MHZ SPI 28SSOP

Microchip Technology

11,800
MCP23S17-E/SS

规格书

- 28-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 16 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 28-SSOP
MCP23008T-E/ML

MCP23008T-E/ML

IC XPNDR 1.7MHZ I2C 20QFN

Microchip Technology

7,805
MCP23008T-E/ML

规格书

- 20-VFQFN Exposed Pad Tape & Reel (TR) Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-QFN (4x4)
MCP23008-E/ML

MCP23008-E/ML

IC XPNDR 1.7MHZ I2C 20QFN

Microchip Technology

6,544
MCP23008-E/ML

规格书

- 20-VFQFN Exposed Pad Tube Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-QFN (4x4)
MCP23008-E/SS

MCP23008-E/SS

IC XPNDR 1.7MHZ I2C 20SSOP

Microchip Technology

2,117
MCP23008-E/SS

规格书

- 20-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-SSOP
MCP23S08T-E/SO

MCP23S08T-E/SO

IC XPNDR 10MHZ SPI 18SOIC

Microchip Technology

18,664
MCP23S08T-E/SO

规格书

- 18-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 18-SOIC
MCP23S08-E/SO

MCP23S08-E/SO

IC XPNDR 10MHZ SPI 18SOIC

Microchip Technology

2,699
MCP23S08-E/SO

规格书

- 18-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 18-SOIC
MCP23008-E/P

MCP23008-E/P

IC XPNDR 1.7MHZ I2C 18DIP

Microchip Technology

219
MCP23008-E/P

规格书

- 18-DIP (0.300", 7.62mm) Tube Active Not Verified 8 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Through Hole 18-PDIP
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