通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

系统级芯片(SoC)

图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCZU1CG-2SBVA484I

XCZU1CG-2SBVA484I

IC ZUP MPSOC CG A53 FPGA 484BGA

AMD

4,319
XCZU1CG-2SBVA484I

规格书

Zynq® UltraScale+™ MPSoC CG 484-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT - 533MHz, 1.333GHz - -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XAZU1EG-1SFVC784I

XAZU1EG-1SFVC784I

IC ZUP MPSOC A53 FPGA Q 784BGA

AMD

2,523
XAZU1EG-1SFVC784I

规格书

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 82K Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU1CG-2SFVC784I

XCZU1CG-2SFVC784I

IC ZUP MPSOC CG A53 FPGA 784BGA

AMD

3,520
XCZU1CG-2SFVC784I

规格书

Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT - 533MHz, 1.333GHz - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU1EG-2SBVA484I

XCZU1EG-2SBVA484I

IC ZUP MPSOC EG A53 FPGA 484BGA

AMD

4,965
XCZU1EG-2SBVA484I

规格书

Zynq® UltraScale+™ MPSoC EG 484-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz - -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XCZU1EG-2SFVC784I

XCZU1EG-2SFVC784I

IC ZUP MPSOC EG A53 FPGA 784BGA

AMD

2,340
XCZU1EG-2SFVC784I

规格书

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XAZU1EG-1SFVA625Q

XAZU1EG-1SFVA625Q

IC ZUP MPSOC A53 FPGA Q 625BGA

AMD

2,571
XAZU1EG-1SFVA625Q

规格书

Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 82K Logic Cells -40°C ~ 125°C (TJ) - - 625-FCBGA (21x21)
XCZU3CG-2SFVC784I

XCZU3CG-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

4,872
XCZU3CG-2SFVC784I

规格书

Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Bulk Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU9CG-1FFVC900E

XCZU9CG-1FFVC900E

IC SOC CORTEX-A53 900FCBGA

AMD

3,146
XCZU9CG-1FFVC900E

规格书

Zynq® UltraScale+™ MPSoC CG 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCVM1302-1LSENSVF1369

XCVM1302-1LSENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

4,284
XCVM1302-1LSENSVF1369

规格书

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 70k Logic Cells 0°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCZU9EG-2FFVC900E

XCZU9EG-2FFVC900E

IC SOC CORTEX-A53 900FCBGA

AMD

2,361
XCZU9EG-2FFVC900E

规格书

Zynq® UltraScale+™ MPSoC EG 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
深圳市通胜兴电子有限公司

搜索

深圳市通胜兴电子有限公司

产品

深圳市通胜兴电子有限公司

电话

深圳市通胜兴电子有限公司

会员