通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

系统级芯片(SoC)

图片 型号 库存 价格 数量 规格书 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCZU3EG-1SBVA484I

XCZU3EG-1SBVA484I

IC SOC CORTEX-A53 484FCBGA

AMD

2,838
XCZU3EG-1SBVA484I

规格书

Zynq® UltraScale+™ MPSoC EG 484-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XCZU3CG-L1SFVA625I

XCZU3CG-L1SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD

4,612
XCZU3CG-L1SFVA625I

规格书

Zynq® UltraScale+™ MPSoC CG 625-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU3CG-L1SFVC784I

XCZU3CG-L1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

1,548
XCZU3CG-L1SFVC784I

规格书

Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU3CG-L2UBVA530E

XCZU3CG-L2UBVA530E

IC ZUP MPSOC A53 FPGA LP 530BGA

AMD

4,903
XCZU3CG-L2UBVA530E

规格书

Zynq® UltraScale+™ MPSoC CG 530-WFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XAZU1EG-1SFVC784Q

XAZU1EG-1SFVC784Q

IC ZUP MPSOC A53 FPGA Q 784BGA

AMD

2,642
XAZU1EG-1SFVC784Q

规格书

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 82K Logic Cells -40°C ~ 125°C (TJ) - - 784-FCBGA (23x23)
XCZU3EG-1SFVA625I

XCZU3EG-1SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD

3,602
XCZU3EG-1SFVA625I

规格书

Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU3EG-2UBVA530E

XCZU3EG-2UBVA530E

IC ZUP MPSOC A53 FPGA 530BGA

AMD

3,854
XCZU3EG-2UBVA530E

规格书

Zynq® UltraScale+™ MPSoC EG 530-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XCZU3EG-L1UBVA530I

XCZU3EG-L1UBVA530I

IC ZUP MPSOC A53 FPGA LP 530BGA

AMD

1,404
XCZU3EG-L1UBVA530I

规格书

Zynq® UltraScale+™ MPSoC EG 530-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XAZU3EG-1SFVA625I

XAZU3EG-1SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD

2,457
XAZU3EG-1SFVA625I

规格书

Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 1.8MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XC7Z030-2FF676I

XC7Z030-2FF676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

AMD

3,076
XC7Z030-2FF676I

规格书

Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
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