通胜兴电子!国内领先的综合性、专业化的电子元器件独立分销商!
制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:

微控制器、微处理器、FPGA 模块

图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0808-05-9BE81-EK

TE0808-05-9BE81-EK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,114

-

- Bulk Active - - - - - - - - -
TE0808-05-BBE81-E

TE0808-05-BBE81-E

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,581

-

- Bulk Active - - - - - - - - -
TE0808-05-6BE81-F

TE0808-05-6BE81-F

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

3,562

-

- Bulk Active - - - - - - - - -
TE0808-05-6BE81-EK

TE0808-05-6BE81-EK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,070

-

- Bulk Active - - - - - - - - -
TE0808-05-BBE81-EK

TE0808-05-BBE81-EK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,664

-

- Bulk Active - - - - - - - - -
G650-04474-01

G650-04474-01

CORAL 4GB SOM

OKdo

4,111

-

- Bulk Active MPU Core ARM® Cortex®-A53 - 1.5GHz 8GB eMMC 1GB - - -20°C ~ 85°C
FORLINX-FET113i-S+12256SN256IA10

FORLINX-FET113i-S+12256SN256IA10

Allwinner T113-I,SOM, 256MB DDR3

Forlinx Embedded

1,448
FORLINX-FET113i-S+12256SN256IA10

规格书

Allwinner T113i-S Tape & Box (TB) Active MPU ARM® Cortex®-A7, Dual-Core - 1.2GHz 256MB 256MB Edge Connector 1.732" L x 1.378" W (44.00mm x 35.00mm) -40°C ~ 85°C
FORLINX-FETMX6ULL-S+08256SN256IA12

FORLINX-FETMX6ULL-S+08256SN256IA12

NXP i.MX6ULLSOM, 256MB DDR3,256M

Forlinx Embedded

2,059
FORLINX-FETMX6ULL-S+08256SN256IA12

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A7 - 80MHz 256MB (NAND) 256MB Edge Connector 1.380" L x 1.732" W (35.00mm x 44.00mm) -40°C ~ 85°C
FORLINX-FET113i-S+12512SE8GIB10

FORLINX-FET113i-S+12512SE8GIB10

Allwinner T113-I,SOM, 512MB DDR3

Forlinx Embedded

4,951
FORLINX-FET113i-S+12512SE8GIB10

规格书

Allwinner T113i-S Tape & Box (TB) Active MPU ARM® Cortex®-A7, Dual-Core - 1.2GHz 8GB eMMC 512MB Edge Connector 1.732" L x 1.378" W (44.00mm x 35.00mm) -40°C ~ 85°C
FORLINX-FETMX6ULL-S+08512SE8GED13

FORLINX-FETMX6ULL-S+08512SE8GED13

NXP i.MX6ULLSOM,512MB DDR3,8GB e

Forlinx Embedded

1,578
FORLINX-FETMX6ULL-S+08512SE8GED13

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A7 - 800MHz 8GB eMMC 512MB Edge Connector 1.380" L x 1.732" W (35.00mm x 44.00mm) -25°C ~ 85°C
FORLINX-FETMX6ULL-C+08512SE8GIA11

FORLINX-FETMX6ULL-C+08512SE8GIA11

NXP i.MX6ULLSOM,512MB DDR3,8GB e

Forlinx Embedded

4,038
FORLINX-FETMX6ULL-C+08512SE8GIA11

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A7 - 800MHz 8GB eMMC 512MB Board-to-Board (BTB) Socket - 160 1.570" L x 1.142" W (40.00mm x 29.00mm) -40°C ~ 85°C
FORLINX-FETA40i-C+121GSE8GEA12

FORLINX-FETA40i-C+121GSE8GEA12

Allwinner A40iSOM,1GB DDR3,8GB e

Forlinx Embedded

2,457
FORLINX-FETA40i-C+121GSE8GEA12

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A7 - 1.2GHz 8GB eMMC 1GB Board-to-Board (BTB) 4 x 80 Pin 2.700" L x 1.772" W (68.00mm x 45.00mm) -25°C ~ 85°C
FORLINX-FET3562J-C+181GSE8GIA10

FORLINX-FET3562J-C+181GSE8GIA10

Rockchip 3562J, SOM, 1GB LPDDDR4

Forlinx Embedded

3,169
FORLINX-FET3562J-C+181GSE8GIA10

规格书

RK3562J Tape & Box (TB) Active MPU ARM® Cortex®-A53 Quad - 1.8GHz 8GB eMMC 1GB Board-to-Board (BTB) Socket - 3 x 80 2.205" L x 1.417" W (56.00mm x 36.00mm) -40°C ~ 85°C
FORLINX-FET3562J-C+182GSE16GIB10

FORLINX-FET3562J-C+182GSE16GIB10

Rockchip 3562J, SOM, 2GB LPDDDR4

Forlinx Embedded

3,477
FORLINX-FET3562J-C+182GSE16GIB10

规格书

RK3562J Tape & Box (TB) Active MPU ARM® Cortex®-A53 Quad - 1.8GHz 16GB eMMC 2GB Board-to-Board (BTB) Socket - 3 x 80 2.205" L x 1.417" W (56.00mm x 36.00mm) -40°C ~ 85°C
FORLINX-FETA40i-C+121GSE8GIB12

FORLINX-FETA40i-C+121GSE8GIB12

Allwinner A40iSOM,1GB DDR3,8GB e

Forlinx Embedded

2,880
FORLINX-FETA40i-C+121GSE8GIB12

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A7 - 1.2GHz 8GB eMMC 1GB Board-to-Board (BTB) 4 x 80 Pin 2.700" L x 1.772" W (68.00mm x 45.00mm) -40°C ~ 85°C
FORLINX-FETMX9352-C+151GSE8GIB11

FORLINX-FETMX9352-C+151GSE8GIB11

NXP i.MX9352SOM,1GB LPDDR4, 8GB

Forlinx Embedded

2,968
FORLINX-FETMX9352-C+151GSE8GIB11

规格书

- Tape & Box (TB) Active - - - - - - - - -
FORLINX-FET3568-C+202GSE16GCA10

FORLINX-FET3568-C+202GSE16GCA10

Rockchip RK3568SOM, 2GB DDR4, 16

Forlinx Embedded

1,199
FORLINX-FET3568-C+202GSE16GCA10

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A55 - 2.0GHz 16GB eMMC 2GB Board-to-Board (BTB) 1.770" L x 2.756" W (45.00mm x 70.00mm) 0°C ~ 80°C
FORLINX-FETT507-C+152GSE8GIA10

FORLINX-FETT507-C+152GSE8GIA10

Allwinner T507SOM, 2GB DDR3L, 8G

Forlinx Embedded

4,092
FORLINX-FETT507-C+152GSE8GIA10

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A53 - 1.5GHz 8GB eMMC 2GB Board-to-Board (BTB) Socket - 240 2.760" L x 1.570" W (70.00mm x 40.00mm) -40°C ~ 85°C
FORLINX-FET1012A-C+10512MOE01IA11

FORLINX-FET1012A-C+10512MOE01IA11

NXP LS1012ASOM,512MB DDR3L 8GB e

Forlinx Embedded

3,862
FORLINX-FET1012A-C+10512MOE01IA11

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A53 - 1.0GHz 8GB eMMC, 16Mb QSPI 512MB Board-to-Board (BTB) Socket - 160 1.770" L x 1.570" W (45.00mm x 40.00mm) -40°C ~ 80°C
FORLINX-FET6254-C+142GSE8GIB11

FORLINX-FET6254-C+142GSE8GIB11

TI AM6254SOM,2GB DDR4, 8GB eMMC

Forlinx Embedded

2,036
FORLINX-FET6254-C+142GSE8GIB11

规格书

- Tape & Box (TB) Active MPU ARM® Cortex®-A53, ARM® Cortex®-M4F - 1.4GHz 8GB eMMC 2GB Board-to-Board (BTB) 4 x 80 Pin 1.496" L x 2.360" W (38.00mm x 60.00mm) -40°C ~ 85°C
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